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Aismalibar, a global leader in advanced thermal management materials for electronics and high-power applications, will exhibit at The Battery Show North America 2026, taking place October 12–15 at Huntington Place in Detroit, Michigan. Visitors can meet the Aismalibar team at Booth 6029, where the company will showcase advanced thermal interface materials, thermally conductive PCB materials and insulated metal substrates designed to address increasingly demanding thermal management requirements in battery systems, power electronics and electric vehicle applications.
As battery and EV systems continue to increase in power density, effective heat transfer and electrical insulation are critical to improving performance, reliability and product life. Aismalibar develops materials engineered to efficiently move heat away from critical components while providing the dielectric performance required for demanding high-voltage applications.
Advanced Thermal Interface Materials
Aismalibar will feature its latest generation of Thermal Interface Materials (TIMs), including BOND SHEET CURED GLASS FREE, developed to provide high thermal conductivity and reliable electrical insulation between heat-generating components and cooling surfaces.
Aismalibar's glass-free technology eliminates traditional glass reinforcement, allowing the dielectric formulation to deliver improved thermal performance and mechanical flexibility. Available in a range of dielectric thicknesses and insulation levels, these materials can be engineered around the thermal and electrical requirements of the application.
The technology is particularly well suited for battery systems and power electronics where minimizing thermal resistance between components, modules and heat sinks can help control operating temperatures and improve overall system reliability.
Glass-Free Thermally Conductive PCB Materials
Aismalibar will also showcase its next-generation glass-free thermally conductive dielectric technology for single-sided and multilayer printed circuit boards.
The material provides thermal conductivity up to 10 W/mK, with dielectric thickness options ranging from 50 to 200 microns and dielectric strength from approximately 3 to 10 kV, depending on the construction.
By combining thermal conductivity with electrical insulation, Aismalibar's glass-free bond sheet technology provides designers with an alternative to conventional glass-reinforced PCB materials in applications where efficient heat removal is critical.
Aismalibar will also feature its HTC 3.2 W/mK high-Tg bond sheets and thin laminates, developed to improve heat transfer through the PCB and reduce dependence on conventional thermal-via strategies. In appropriate applications, improved PCB-level thermal management can significantly reduce component operating temperatures, supporting increased output, reliability and product life.
High-Performance Insulated Metal Substrates
For applications requiring even greater heat dissipation, Aismalibar will present its COBRITHERM insulated metal substrate (IMS) technologies, including COBRITHERM ULTRATHIN 5W and 8W materials.
Aismalibar's IMS constructions combine a metal base with a proprietary thermally conductive polymer-ceramic dielectric and copper circuitry, providing an efficient thermal path while maintaining electrical insulation.
These materials are designed for demanding power electronics applications where high heat loads must be transferred rapidly away from power components. Compatibility with conventional PCB manufacturing and direct SMD assembly also allows designers to incorporate advanced thermal management directly into the electronic substrate.
Supporting the Next Generation of Battery and EV Technology
Engineers, designers and manufacturers attending The Battery Show North America are invited to visit Aismalibar North America at Booth 6029 to discuss their thermal management challenges and explore material solutions for improving heat dissipation, electrical insulation, reliability and system performance.
