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MacDermid Alpha to Showcase SiC Power Module Technology at electronica 2026

11/03/2026 | MacDermid Alpha
MacDermid Alpha Electronics Solutions will exhibit at electronica 2026 (November 10–13, Messe München, Booth C2.654), showcasing its upcoming BondPad technology, an Argomax® film-laminated copper-foil solution for sintered die-topside attach in high-power, high-reliability silicon carbide (SiC) packages.

TI Marks 70 Years of Innovation in Europe

11/03/2026 | PRNewswire
Texas Instruments (TI) is celebrating 70 years of operations in Europe, demonstrating its long history of semiconductor innovation, research and development, manufacturing and customer partnership in the region.

onsemi to Acquire Ferric

11/03/2026 | onsemi
onsemi announced that it has entered into an agreement to acquire Ferric, Inc., an innovator in integrated voltage regulator (IVR) technology, for $600 million in cash, plus up to $175 million in contingent consideration upon achievement of certain revenue milestones.

TECO, Foxconn Showcase NVIDIA-Based Modular Data Center

11/02/2026 | Foxconn
Teco Electric participated in Foxconn Technology Day for the second time, focusing on its Modular Data Center (MDC ) concept developed in cooperation with Foxconn. The MDC is based on the NVIDIA DSX POD reference design.

Flex Reports Q2 FY2027 Sales Growth of 25%, Record Adjusted EPS

10/30/2026 | Flex
Flex announced results for its second quarter ended September 25, 2026.
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