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SMTA is pleased to announce a new name and expanded technical scope for the former Wafer-Level Packaging Symposium. The new event is called the Microelectronics Packaging & Integration Symposium, which takes place February 9-11, 2027 in San Francisco, CA, USA.
The transition to the Microelectronics Packaging and Integration Symposium reflects the expanding scope of advanced packaging technologies and the growing role of integration in next-generation electronic systems. The technical program and exhibition focus on advanced semiconductor packaging, spanning wafer- and panel-level packaging, 3D and heterogeneous integration, advanced manufacturing, test, metrology, and other emerging industry trends.
“Our new name better represents the diverse technical program and conversations shaping the industry,” said conference chair, Thomas Gregorich. “It also reflects our commitment to evolving alongside the industry and meeting the changing needs of our attendees by providing relevant technical presentations, meaningful discussions, and opportunities to connect with experts and innovators.”
The technical committee is currently soliciting abstracts of relevant research through December 10, 2026.
