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Zhen Ding Technology Holding Limited, a global leader in PCB manufacturing, participated in the “TPCA Show Trends Forum” at the 2026 TPCA Show on October 21. General Manager Jeff Chien joined senior executives from global materials supplier Qnity and equipment manufacturer KLA in a panel discussion titled “From Technological Innovation to Global Mass Production: Strengthening Supply Chain Resilience in the AI Era,” sharing insights into key trends shaping the advanced PCB industry amid rapid AI growth.
Chien noted that as AI infrastructure expands, advanced PCBs are evolving toward higher transmission speeds, greater interconnect density, and more complex manufacturing processes. Competition will increasingly depend on technological capabilities, production scale, smart manufacturing efficiency, global mass production capabilities, and supply chain integration. The ability to translate technological breakthroughs into scalable production with consistent quality, high yields, and reliable delivery will be critical to long-term competitiveness.
Zhen Ding operates 28 plants across mainland China, Thailand, and Kaohsiung, with another 22 under construction and nine in the planning stage. All new plants will focus on advanced automation, digitalization, and AI-enabled smart manufacturing. The company was the first PCB manufacturer to adopt the semiconductor industry's SECS/GEM equipment communication standards, covering 150 suppliers, more than 1,000 equipment types, and over 5,000 machines.
Zhen Ding continues to integrate AI into equipment monitoring, early warning systems, yield analysis, and production management. Certain AI applications have already reduced task time by up to 90%. Through AI and big data analytics, the company aims to improve process management, accelerate new product introductions and yield ramp-ups, increase production efficiency and output per employee, and strengthen profitability.
Chien also emphasized the importance of collaborative R&D and supply chain integration as technological challenges increasingly span materials, equipment, and manufacturing processes. In July 2026, Zhen Ding hosted its Global Supplier Conference, bringing together 247 suppliers and more than 400 representatives. The company works with materials suppliers, equipment partners, and academic and research institutions to accelerate technology commercialization and strengthen access to critical resources.
Zhen Ding is also advancing industry-academia collaboration through the Advanced PCB Talent Development Program with National Central University, the Zhen Ding-Tsing Hua Joint Research Center at National Tsing Hua University, and the Green AIPCB Collaborative Laboratory with Chung Yuan Christian University. These initiatives support technology development and interdisciplinary talent cultivation, particularly in manufacturing processes, data analytics, and AI applications.
As global AI infrastructure expands and supply chains are restructured, Zhen Ding is leveraging its “One ZDT, One Team” strategy to extend the process expertise, quality standards, and smart manufacturing capabilities of established production bases to new facilities worldwide. The company aims to accelerate capacity ramp-ups and achieve stable mass production while pursuing growth opportunities in AI servers, high-speed optical modules, IC substrates, and edge AI.
