There is a single decision at the center of every die-attach conversation right now that isn’t as much about chemistry as it is about control. This is most evident because silver prices have experienced significant volatility, evolving PFAS requirements are increasing regulatory and customer scrutiny, qualification windows are shrinking, and the packages that support AI, automotive, and power infrastructure must meet demanding performance and reliability requirements.
The engineer responsible for die attach material selection must balance all these requirements simultaneously: manage cost exposure, demonstrate reliability, address evolving compliance requirements, and protect throughput, while selecting the material and process best suited to the applications.
That is a lot to put on a single bond line. When looking at silver, for example, instead of simply asking, “How can we reduce silver?” we should ask, “Where does a copper-based alternative make technical and commercial sense, and how do application requirements guide the decision?” Copper is already widely used in interconnects, lead frames, and substrate metallization. When engineered into a conductive die attach paste, it can provide the thermal, electrical, and mechanical characteristics required for appropriate applications while reducing exposure to silver-related cost volatility.
ATROX CD 560-1 is not a replacement for every silver application, but rather a copper-filler die-attach technology for applications where it provides the right balance of performance, reliability, manufacturability, and cost. Silver-based technologies remain the appropriate choice where application and performance requirements demand them.
Let’s look at what has happened with recent silver prices. In 2025, silver started at about $30 an ounce. It rose 144% by the end of the year, finishing at over $70, significantly outpacing gold.1 Industrial consumption of silver had already reached record levels in 2024, with industrial demand totaling 680.5 million ounces and record consumption in electrical and electronics applications, including photovoltaic manufacturing.
To continue reading this article, which appeared in the October 2026 SMT007 Magazine, click here.