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MacDermid Alpha Electronics Solutions will exhibit at electronica 2026 (November 10–13, Messe München, Booth C2.654), showcasing its upcoming BondPad technology, an Argomax® film-laminated copper-foil solution for sintered die-topside attach in high-power, high-reliability silicon carbide (SiC) packages.
As SiC power devices drive higher switching frequencies and operating temperatures, manufacturers of advanced power semiconductor packages are increasingly moving from conventional solder and aluminum wire-bonding toward sintered die attach and die-topside interconnects that withstand demanding thermal-cycling conditions. The forthcoming BondPad solution combines copper foil with Argomax sinter film. During sintering, the Argomax layer metallurgically bonds to the die topside to create a fully sintered interface, while the exposed copper surface provides a durable landing area for subsequent copper wire or copper ribbon bonding using established wire-bonding equipment.
Compared with silver sinter paste-based topside attach approaches, Argomax BondPad will use a proprietary silver sinter film to control bond line thickness, avoid the print and dispense dimensional variability, and reduce overall processing time. The solution combines a 50 µm nominal copper foil with an Argomax layer, providing a consistent sintered bond line of approximately 20 µm and creating a flat, even copper surface for subsequent copper wire or ribbon bonding. Under specified power-cycling test conditions, BondPad with integrated Argomax technology achieved more than 75,000 cycles against 2,500 cycles for the standard conventional aluminum wirebond reference. This represents approximately 30 times longer life under these test conditions. Testing was conducted at 180 amperes, with a 110°C temperature swing and a maximum junction temperature of 175°C, using a 5% increase in drain-to-source voltage as the failure criterion.
Designed particularly for SiC dies and high-power packages, BondPad can also simplify manufacturing by using existing wire-bonding equipment. It supports machine placement from tape-and-reel for fast, accurate, and cost-effective automated assembly.
MacDermid Alpha Electronics Solutions will also showcase its broader sintering and solder portfolio, including its new ALPHA® ARGOMAX® AccuLam™ 8022 silver sintering film for reliable die attach and ALPHA® TrueHeight® Solder Preforms for precise bond line control.
“As power density increases, the reliability of every interface within the power package becomes increasingly critical,” said Gustavo Greca, Line of Business Director for Power Electronics at MacDermid Alpha Electronics Solutions. “With BondPad, we are extending silver sintering technology beyond traditional die attach to the die-topside interconnect, giving customers another way to improve power module reliability and process control while continuing to use established manufacturing infrastructure.”
Visitors to Booth C2.654 can meet MacDermid Alpha’s technical specialists to discuss power module design challenges, material selection, and sintering and solder processes. To arrange a meeting or request a technical data sheet or sample evaluation, contact MacDermid Alpha.
