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Indium Corporation, a leading materials manufacturer and supplier to the global electronics, semiconductor, and thermal management markets, will feature a range of high-reliability, AI-enabling advanced materials at the International Conference for High Performance Computing, Networking, Storage, and Analysis (SC26), November 17-19, in Chicago, Illinois.
The company will feature the following products:
- Solder Thermal Interface Materials (sTIMs) deliver superior heat dissipation and high thermal conductance for power-dense devices exceeding 1,000 watts. Optimized for BGA package applications, sTIMs enable low-void, high-reliability performance across multiple reflow cycles, ensuring thermal stability. Unlike fluidic solutions, they ensure reliable end-of-life performance, preventing failures common with greases. Ideal for portable electronics, sTIMs enhance battery life, reduce cooling fan size, and minimize heat-sink mass while maintaining RoHS compliance and supporting sustainability initiatives.
- Heat-Spring® is a compressible, non-reflow metal thermal interface material (TIM) ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86 W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems and offers a sustainable solution through the company’s metals and compounds reclaim and recycle program.
- GalliTHERM® is a portfolio of gallium-based liquid metal solutions built on more than 60 years of expertise in manufacturing advanced gallium materials. Designed for both TIM1 and TIM2 applications, these liquid metal TIMs offer cutting-edge thermal interface performance with superior reliability.
