ASMPT Management Team Visits Technica USA to Advance Collaboration on AI-Driven Electronics Manufacturing

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Technica USA was pleased to welcome members of ASMPT’s management team to its headquarters and Demo & Applications Center this week. Technica’s facility serves as a hub for customer demonstrations, technical training, application development, and industry events throughout the year.

Over the past year, Technica USA and ASMPT have further strengthened their collaboration by co-hosting three major events. The first was Technica’s Annual Tech Day, which featured ASMPT’s new SOLO placement head for large and heavy BGA components. A few weeks later, Technica and ASMPT hosted a separate, invitation-only event dedicated to providing customers with a more in-depth look at the technology and its capabilities. More recently, the two companies co-hosted an event showcasing the SIPLACE CA2 and its innovative pick-from-wafer technology.

Technica’s Annual Tech Day, held in May, featured ASMPT alongside other leading technology partners, with a focus on the challenges and emerging technologies associated with placing and inspecting large and heavy BGA components. The event provided an opportunity for Technica to demonstrate ASMPT’s unique capabilities in handling particularly large and heavy components.

The new SIPLACE SOLO placement head can handle components measuring up to 240 × 240 millimeters (9.45 × 9.45 inches) and weighing more than 2 kilograms (4.4 pounds), with future capability expected to increase to as much as 5 kilograms (11 pounds) by year end. This specialized demonstration generated significant interest among customers and OEMs, reflecting the growing demand for advanced electronics manufacturing solutions.

The rapid expansion of AI applications and the computing power required to support them are accelerating the development of highly integrated, multi-die modules. Many of Technica’s PCB assembly customers and OEM partners are deeply involved in these advanced developments. As a result, Technica is experiencing increased customer engagement and activity, bringing senior management from many of the companies it represents to Technica’s facility and customer locations.

This week, Technica was pleased to host Waldemar Christen, Senior Vice President of CRM; Gary Burroughs, Director of Account Management; and Ovi Ungureanu, Regional Manager, all representing ASMPT. Their visit included a full schedule of meetings focused on active customer projects, ongoing technical developments, and business opportunities extending into 2026 and beyond.

Jason Perry, President of Technica USA, commented, "We were very pleased to welcome Waldemar Christen from Germany to Technica. This was his first visit to our facility, and it provided an excellent opportunity to showcase our Demo & Applications Center and the capabilities we offer our customers.

While the primary purpose of his visit was to get a closer view of the many active projects related to AI and the associated challenges of placing large and heavy BGAs, it was also an opportunity to give him a firsthand look at the investments Technica has made in supporting our customers and technology partners.

We always appreciate the opportunity for our supply partners to see that Technica is more than a traditional sales representative organization. We are a technology partner, actively supporting our supply partners, PCB fabrication and assembly customers, and OEMs with the technical expertise, applications support, and resources needed to address increasingly complex manufacturing challenges.

Waldemar expressed his appreciation for the support Technica provides to ASMPT throughout the Western United States. The level of activity surrounding AI, advanced packaging, and next-generation computing continues to create exciting opportunities for both Technica and ASMPT."

As a subsidiary of EMC Taiwan, Technica USA looks forward to building on its established industry relationships while developing new partnerships that support the company's continued growth across the microelectronics manufacturing ecosystem.