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High Density Packaging User Group (HDP) Welcomes Lincstech as New Member

07/01/2025 | High Density Packaging User Group
High Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.

Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation

07/01/2025 | Zhen Ding
To advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.

EU Defence Electronics Ecosystem Highlighted in Brussels

07/01/2025 | I-Connect007 Editorial Team
In this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 16, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.

Smarter Machines Use AOI to Transform PCB Inspections

06/30/2025 | Marcy LaRont, PCB007 Magazine
As automated optical inspection (AOI) evolves from traditional end-of-process inspections to proactive, in-line solutions, the integration of AI and machine learning is revolutionizing defect reduction and enhancing yields, marking a pivotal shift in how quality is managed in manufacturing.

PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025

06/27/2025 | PRNewswire
The Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
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