-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
What is DFM, Really?
May 28, 2014 | Mark Thompson, CID, Prototron CircuitsEstimated reading time: 1 minute
Okay, so what is DFM, really? The term "design for manufacturability" has been used for many years now, but does everyone really understand this concept?
For instance, do you design for 10%? Do you design for a specific manufacturer’s capabilities, therefore making you less likely to seek alternative fabricators? How are your drawings worded?
In this article, I will be discussing the reality of DFM and what benefits you, the end-user, by embracing these practices.
Why Design For Manufacturability at All?
Good question. Even if you only buy your boards from a single source--if you have qualified the company already and feel you can expect certain press parameters and dielectric constants based on what they have provided you--it is STILL a good idea to at least design with some latitude. If your design is .1 mm lines and spaces there is not a whole lot of room to either expand or decrease the traces to achieve certain impedances. Clearly, when you have to ingress and egress out of tight-pitch components and your design takes you down to .003”/.003” there is NO ROOM at all for an etch compensation, so you are typically quoted by manufacturers as quarter-ounce foil start. This foil is so thin that we need not compensate for a loss at the etcher like the other copper weights.
Again, as I have mentioned before in my columns, the general rule of thumb is that for every half-ounce of starting copper, you give all the metal features an etch compensation of half a mil. Asking for 1 oz. starting copper, for instance, with 0.003”/0.003” will normally be a no-bid as fabricators would be hard-pressed to be able to run with .002” spaces at Image prior to etch. (Attempting to compensate the 0.003” traces for 1 oz. copper with 1 mil will result in 0.002” spaces at Image prior to etch.) So, 0.003”/0.003” is usually the limit.
Read the full article here.
Editor's Note: This article originally appeared in the May 2014 issue of The PCB Design Magazine.
Suggested Items
Fresh PCB Concepts: PCB Design Essentials for Electric Vehicle Charging
11/27/2024 | Team NCAB -- Column: Fresh PCB ConceptsElectric vehicles (EVs), powered by electricity rather than fossil fuels, are transforming transportation and reducing environmental impacts. But what good is an EV if it can't be easily charged? In this month's column, Ramon Roche dives into the role of printed circuit boards (PCBs) in electric vehicle charging (EVC)—and the design considerations.
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.