More productronica Exhibits

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Offset Placement after Solder Screen Printing

JUKI’s solution for offsetting placement after solder screen printing, addresses the problem of solder paste alignment errors.  With this technology, the placement machine can automatically detect and compensate for misalignment of the solder paste to produce high-quality boards regardless of the process errors beforehand.  While board makers strive to keep variations between lots to an absolute minimum, it is not possible for them to eliminate forward expansion and scaling completely. This means that the pads are not exactly in the same positions as they were on the previous lot. When the boards are fed into the stencil printer for solder paste there can be slight offsets from the solder paste print to the pad location. In larger parts that can be a very small percentage of the pad size, but in smaller parts like 01005, 0201 or even 0402, the solder could be halfway off of the pad. Likewise with ceramic or flexible boards, print repeatability can be difficult to achieve, causing further solder paste alignment problems. There also is cause for concern on double-sided boards because boards tend to contract after the first side reflow process. With the increased use of lead-free solder, the properties of the self-alignment effects have changed. Through extensive research and cooperation with high-volume manufacturers, Juki has found that placing small components centered on the paste and not the pad will reduce the defect rate. The Offset Placement After Solder Screen Printing system addresses this issue. When the system is integrated into the electronics assembly machine, it eliminates the need for other equipment such as AOI machines to correct for solder paste alignment problems and provides a comprehensive solution to meet the future market trends of component miniaturization, high-density placement and lead-free assembly.

In-House Event

Siemens Electronics Assembly Systems GmbH & Co. KG will welcome interested visitors to a special in-house event at its headquarters location. The SIPLACE team will focus especially on the exchange of information with experts from the electronics manufacturing industry. In workshops and presentations, visitors can exchange information and talk about the opportunities provided by modern build-to-order manufacturing concepts. Well-known electronics manufacturers like ebm-papst, Gigaset, Pepperl & Fuchs and Epcos will give practice-oriented presentations about their manufacturing process improvements and their respective results. In the technology exhibition, visitors will be able to take a close look at live demonstrations of placement solutions from the SIPLACE D-Series and X-Series as well as the SIPLACE SX with interchangeable gantries, the SIPLACE MultiStar head, and the latest software developments such as SIPLACE Facts and SIPLACE LES. During guided tours of the new SIPLACE factory, visitors can see how the SIPLACE placement solutions are manufactured in accordance with lean production principles. The SIPLACE in-house event will be open for all industry visitors on Productronica show days from 9:00 AM until 5:00 PM. Transfer to the SIPLACE facility from the Trade Fair Centre is via a shuttle bus service. To request a detailed program and receive an invitation, log on to www.siplace.com/productronica.

Automatic Defluxing System and Cleanliness Tester

The Trident automatic defluxing system has specific throughput rates determined by board size. The system is capable of defluxing and cleanliness testing up to 200 101 × 152 mm boards and up to 28 457 × 508 mm boards per hour. The system offers several defluxing configurations designed to provide complete compatibility with all defluxing requirements. The process consists of up to five cycles: prewash, wash, rinse, cleanliness testing, and drying. Prewash may consist of a steam soak, high-pressure DI water spray, or chemical spray and soak. The wash cycle uses environmentally responsible defluxing solutions, neutralizing and solublizing flux and other residues. The rinse cycle is controlled by the built-in cleanliness tester in which rinse cycles are added or subtracted from the process automatically. The dry cycle uses a combination of radiant and convection heat for rapid, thorough drying. Equipped with an automatic chemical management system that automatically measures and doses concentrated defluxing chemicals into the wash-solution recirculation system, the wash solution is captured and reused, eliminating routine chemical discharge. Level gauges indicate the available levels of wash solution and concentrated chemical. Trident is also equipped with an inverse-mounted vertically oriented spray pump that virtually eliminates pump-caused dragout. Built-in statistical process control (SPC) data capturing technology allows users to view historical SPC data, including actual cleanliness results, at the machine and remotely.The Zero-Ion ionic contamination (IC) cleanliness tester automatically removes and detects contamination on an electrical assembly or bare board and provides quantitative contamination measurements. The Zero-Ion uses a dynamic technology that provides automatic regeneration of the machine’s test solution, maintaining a high degree of test solution sensitivity. The Zero-Ion meets the requirements of military and commercial cleanliness testing standards including MIL 2000A, IPC test method 001, MIL-C-28809, MIL-P-55110 and IPC TM650-2.3.26. It has been reviewed by the U.S. Naval Air Weapons Center and determined to be the most sensitive ionic contamination tester available, 3.7× more sensitive than the manual resistivity of solvent extract (R.O.S.E.) test. The Zero-Ion performs cleanliness tests automatically and is capable of storing 50 test parameters within its internal controller. When connected to a PC, it can store virtually unlimited quantities of testing parameters and comes with built-in printer to record results. Aqueous Technologies Corp., A2.599.

Automated Handler for Flashstream Technology

Flashstream automated programming technology, the 3000FS, is designed to solve excessive programming times in current in-system, JTAG and in-circuit programming production methods, the 3000FS is modeled from the current BPM 3710 handler and contains four Flashstream programming sites. Rated at 1100 devices per hour, the new 3000FS is flexible enough to handle parts in tray, tube or tape for device input or output. Combining these two technologies gives the 3000FS automated flash programmer the ability to produce a fully programmed 512Mb NAND Flash memory device every 3.4 seconds or 1100 devices in an hour. Flashstream technology uses a proprietary co-processor technology, Vector Engine, to hardware-accelerate flash memory waveforms during the programming cycle. Faster speeds are achieved through synchronous operations that eliminate the dead times when the DUT waits on the programmer. BPM Microsystems, with distributor PB Tec, A2.377.

High-purity Solders and Alloys

Showcasing lead-free and tin/lead alloys, the team will be on hand during the event to offer expertise and product and application advice. The company is the U.K. producer of the SN100C solder alloy from Nihon Superior. It also supplies the Cobar product range, with Cobar representatives also available during the show. The Cobar product range includes solders, liquid fluxes, thinners, rework fluxes, cleaning agents, peelable soldermask, cobrush flux applicators, and solder pastes and cored solder wires. DKL Metals Ltd., A4.570.

AOI and SPI Systems, X-ray Inspection, and Software

The MV-7xi in-line AOI system is configured to provide one high-resolution color digital top-down camera and four of the same fitted as side-view cameras. The Quad Angle Lighting System provides four independently programmable zones for optimal illumination of inspection areas. The MV-7xi demonstrated will feature a 2D camera bar code reader, a high-throughput three-stage PCB conveyor, and a PCB under-board support system. This system will also be configured with the Intelli-Scan Laser System for lifted lead detection for gull wing devices, four-point height measurement capability for co-planarity testing of BGA and CSP devices, and enhanced solder paste measurement capability. A comprehensive Package Type Library provides simple “Drag and Drop” component programming. The Automatic Teaching Tool (ATT) software provides automatic teaching of component locations using CAD centroid data.The MV-3L five-camera desktop AOI system will be displayed with one high-resolution color digital top-down camera and four more as side-view cameras, as well as the Intelli-Beam Laser System. The system can measure the Z-axis of a given region of interest. The MS-11 in-line SPI system uses Shadow Moiré technology and phase stepping image processing to inspect solder paste deposition on PCBs post screen print.  The MS-11 detects insufficient solder, excessive solder, shape deformity, shift of deposition, and bridging. Its two megapixel camera system enhances image quality and accuracy. The X-Scope 2000 X-ray system features true 5 µm focal spot size, 130 kV real-time 1280 × 1024 output, 125× geometric magnification, 600× optical magnification with CNC capability.A total quality management system software, Intellisys promotes continuous process improvement by allowing manufacturers to track and eliminate defects on inspected assemblies. Intellisys also provides remote debugging and monitoring of up to 8 production lines. Typical programming time is under one hour per assembly. The standard SPC software package promotes continuous process improvement by allowing the user to track and eliminate defects on inspected assemblies.  MIRTEC, A2.377.

Spectrum Thermal Process Optimization Software

For increased solar cell efficiencies, the Spectrum thermal process optimization software automatically identifies the correct furnace set up that achieves a thermal profile that is positioned within the sweet spot of the established process window for solar cell manufacturing. The Spectrum is a software-only option for the SunKIC profiler. KIC, with GS Electronics, B3.136.

Reflow Oven Optimization

The Navigator Power software has proven to reduce electricity use in reflow ovens by up to 15%. It enables users to search on oven recipes (zone temperatures and conveyor speed) that position the thermal process deep in spec while allowing the reflow oven to run at the lowest possible consumption of electricity. Third-party research has verified the ability of the Navigator Power to reduce energy consumption while maintaining product quality on all reflow ovens in the factory. KIC, A4.570.

RF Matrices

This range of scalable RF matrix switching solutions with LXI-compliant Ethernet control uses an innovative construction that allows Pickering Interfaces to create almost cable-free RF matrices in 50 and 75 ? with frequency coverage up to 3 GHz. The first product introductions are 32×16 and 32×8, and the construction methods used allow the creation of a wide range of other matrix sizes. The product family targets more affordable and flexible RF matrix switching. Pickering Interfaces, A1.344.

Test System

The V8 flying probe test system has a vertical architecture that enables high-speed, high-precision probing on both sides of the UUT simultaneously, offering the maximum in test coverage and flexibility in a compact, ergonomic package. It is equipped with eight electrical flying test probes (four on each side), two Openfix capacitive and two power flying probes, plus two CCD cameras (one on each side). With 14 mobile resources available to test the UUT, Pilot V8 has a range of in-circuit and functional test capabilities. In addition, like other Seica flying probe solutions, the Pilot V8 can implement a series of net-oriented measurement techniques based on measurements executed on the board signal nets. These new test methods cut the time required for in-circuit test by lowering the number of measurements required, maintaining the same level of fault coverage and valuable diagnostic information. The mobile power probes are another innovation that enable UUT power-up without additional fixed cables. Pilot V8 can also execute parallel tests on two UUTs. Seica, A1.548 and B2.125.

Selective Soldering System

Based on the VIVA Integrated Platform, the Firefly laser selective soldering system offers a three-step process for generating, verifying and running a soldering program, as well as other software tools that can improve system flexibility and performance. The integrated temperature-control system provides feedback during the soldering process with a real-time, on-screen display of thermal profiles. Seica, A1.548 and B2.125.

Pick-and-Place Capacity VariationTrue Capacity on Demand for the high-volume A-Series can save 20% of initial capital costs. True Capacity on Demand (TCoD) solves the problem of seasonal production fluctuations. Customers buy only the base pick & place capacity they need, and simply rent extra pick-and-place heads from Assembléon to meet peak demand. The modular design of A-Series pick & place machines means there is no change to the equipment footprint. The calibration-free robots are fitted to the machines on the line with no need to change internal hardware. The machines offer high first pass yield (FPY) and low cost of placement (including energy consumption). A new tray trolley for the AX-201 uses a caching system to double the feeding speed. Assembléon, A2.477.

Screen Printer & Placement Combo

Targeting high mix, medium volume production, an MC-P screen printer will be demonstrated with the MC-5 and MC-8 pick & place machines. The MC-P screen printer has a servo-driven squeegee with variable attack angle to improve solder filling levels. It varies the blade contact angle on-the-fly via software for consistently flat and uniform solder deposits, even when mixing large and small components. The MC-5 is a new generation high-speed chip mounter with a speed of 24,000 CPH on a 1.25-m-long footprint. It has 118 tape feeding positions. The MC-8 has up to 119 feeders, and places chips, ICs, and odd-form components. It places up to 8.9k components per hour with an accuracy of 30 µm for ICs and QFPs. Precision force control places press-fit through-hole connectors with insertion forces up to 30 N. Assembléon, A2.477.

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