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December 31, 1969 |Estimated reading time: 5 minutes
Executive Briefings Focus on Interconnects
BPA Consulting Ltd. and Quantum Performance Group, LLC will present Executive Briefing Meetings (EBM) on “Next-generation Interconnect Technology for High-speed and Miniaturized Systems” in Newport Beach and San Jose, Calif., and Boxborough, Mass., the week of April 18, 2005. EBM topics will include:
- Next-generation systems - the demand and driving forces for innovative interconnects.
- World-wide, high-speed interconnect technology, market trends, manufacturing challenges and opportunities.
- Flexible and rigid-flexible circuits manufacturing, materials and trends.
- Future structure and strategic implications for participants in the interconnect supply industries.
- Asia - opportunity, threat, or both?
Speakers include Michael Campbell, Daniel (Baer) Feinberg, Dr. James J. Hickman, Mark Hutton, Nicholas Pearne, Francesca Stern and Gene H. Weiner. Each meeting is limited to 25 delegates. Attendees will have the opportunity to network with other executives from industries such as specialty chemicals, materials, process equipment, components, fabrication, assembly, design services and system house. UK-based BPA Consulting and Quantum Performance Group are consulting firms that deal with the electronics packaging and interconnect industries. For more information, visit www.bpaconsulting.com or www.quantumpg.com.
PCB Book-to-bill ratioDecember 2004 Book-to-Bill Ratio Bounces Back
NORTHBROOK, Ill. - The IPC IMS/PCB book-to-bill ratio for December 2004 rose to 1.04 after a one-month dip below parity. IPC now is reporting separate statistics for the rigid PCB and flexible circuit segments of the industry, with a book-to-bill of 0.93 for rigid PCBs and 1.41 for flexible circuits. For these two segments combined, sales billed (shipments) in 2004 increased 8.7% year-over-year, and orders booked increased 30.6% from December 2003.
December’s overall book-to-bill level rose to 1.04, orders booked for December 2004 are up 1.6% over the previous month, and bookings are up 73.4%.
Internepcon World Japan 2005 Holds True to Claim
TOKYO, JAPAN - Internepcon World Japan 2005, organized by Reed Exhibitions Japan, Ltd., is touted as Asia’s largest exhibition in Electronics Manufacturing. This year’s show, held January 19-21, at Tokyo Big Sight lived up to that claim with a record number 988 exhibitors from all facets of the electronics industry. Reed reports 57,921 attendees were on-hand to visit Internepcon Japan, Electrotest Japan, IC Packaging Technology Expo, Printed Wiring Board Expo, Electronic Components Expo and the Fiber Optics Expo. Keynote sessions ran congruent to the show, as did 66 technical sessions.
Internepcon World Japan 2006 is scheduled for January 18-20, 2006, at Tokyo Big Sight, Japan.
Juki Automation Appoints President
MORRISVILLE, N.C. - Juki Automation Systems, Inc. appointed Robert Black, Jr., president and CEO. Black, former chairman of the board and CEO, replaces Kaz Nomoto, who has been promoted to General Manager of the EATS Planning Division for the Tokyo-based Juki Corporation and chairman of Juki Automation Systems.
As president and CEO, Black will oversee corporation finance and operations and manage liaison activities with Juki Corporation of Japan. Black has served as chairman of the company since 1999.
Speakers Selected for ASC Convention
BETHSEDA, MD. - The Adhesive and Sealant Council (ASC) has selected speakers for its 2005 Spring Convention and Exposition, to be held in Columbus, Ohio, from April 17-20. Roger D. Blackwell, professor of marketing at The Ohio State University will present, “Brands That Rock: What Business Leaders Can Learn from Rock ‘n Roll;” Fred Peterson, president of Probe Economics, Inc., will lead “Trench Warfare and the Markets: Economy, Energy, Chemicals and China;” and Landy Chase, sales and marketing trainer, speaker and author will present, “Winning on Value vs. Losing on Price: What the Leaders Do Best in the Adhesives Industry.” The convention also will feature a two-and-a-half day conference program, networking events and an adhesives and sealants exposition. Educational sessions also are available. Further information on the ASC 2005 Spring Convention and Expo is available at www.ascouncil.org.
Pulse Receives Supplier Award
SAN DIEGO, CALIF. - Huawei-3Com, an enterprise networking company based in China, has awarded Pulse its Golden Supplier Award for technology leadership, superior quality, on-time delivery and sales support. Yi Shao Shan, vice president of Huawei-3Com presented the award to K.C. Ng, Asia sales director for Pulse. Pulse supplies Huawei-3Com with magnetic components used in information and communications equipment.
Solectron CEO Shares Outsourcing Knowledge
MILPITAS, CALIF. - Solectron president and CEO Mike Cannon believes that achieving full benefits requires a long-term view and collaboration from both sides; and he brought this message to the World Economic Forum in Davos, Switzerland, held in Januray. On a panel titled, “Beyond Politics: How to Make Global Outsourcing Work,” Cannon urged attendees to consider the economic, environmental and social responsibility implications needed for a successful outsourcing relationship. Cannon emphasized that outsourcing success is possible only when each partner trusts and depends on the capabilities of the other. He suggested that companies align business models with their partners as if it were a peer-to-peer relationship, instead of a command chain. Cannon also touched on how the complex framework of environmental legislation makes it necessary for manufacturers to collaborate with their partners to guarantee full product compliance. Ways in which outsourcing partners can see success through more holistic and socially responsible approaches also was discussed.
DEK Names Product Manager in Germany
GERMANY - DEK has appointed Güler Basol as the product manager for its Distributed Products (Consumables) division based in Germany. This new position was created to help drive DEK’s Distributed Products business from a region instead of global basis to better serve customers. Basol will develop and shape the company’s European Distributed Products business, which has experienced 10 to 15% growth each year over the last three years. This business unit underpins the Engineered Products (stencils, screens and toolings), Service and Support and Printing Machines units.
IPC Delivers Business Data Report
BANNOCKBURN, ILL. - IPC - Association Connecting Electronics Industries has created a quarterly business data report, set to launch in May 2005. The IPC Supply Chain Tracker will bring readers a collection of market data on the electronics interconnection industry - from solder paste, laminate, process consumables and assembly equipment to PCB fabrication, assembly and OEM industries. Readers will gain insight into how these industries affect their companies, helping them plan for changes in the business environment. “Growth rates in solder, semiconductor and assembly equipment shipments can help both PCB and EMS companies anticipate growth in the demand for their services,” said Sharon Starr, IPC director of market research. “For OEMs, growth in orders for PCBs and electronics equipment also can be useful.”
The IPC Supply Chain Tracker will be available to all Technology Market Research Council (TMRC) member facilities in 2005. Exemptions will be made for companies the IPC statistical program does not serve currently, such as OEMs. The report is slated to debut at the TMRC spring conference in Baltimore, Md.