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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Ventec USA Prepares for Growth
April 17, 2014 | Pete Starkey, I-Connect007Estimated reading time: 3 minutes
Starkey: Ray, I’m impressed by your CV. In my opinion, you have the ideal background for the job.
Young: What I can offer is 40 years’ experience in PCB fabrication. I started straight from high school and worked my way up the ladder from hands-on, shop-floor processing through plant management and general management to senior operations executive roles. And I have worked for some big-name companies supplying the high-technology, high-reliability electronics industry. I’ve got a lot of experience of AS9100C aerospace industry quality management systems, a lot of confidence in Ventec’s materials from a user viewpoint, and a clear appreciation of the high level of support that Southern Californian PCB fabricators demand of their suppliers.
Starkey: And what are your plans for the expansion of the Fullerton service centre?
Young: As well as doubling our panel-sawing capacity and installing clean-room cutting and packaging for pre-pregs, we plan to streamline our distribution channel to give the best possible value to customers in terms of quality, technology, service, and cost. We understand the high-mix, quick-turn nature of our market and can ship almost everything same-day.
Having a press facility, we can cater for the odd-ball requirement--whatever the diversity of material we hold in stock, someone will always want what we don’t have on the shelf. So we can manufacture small quantities of specialist and odd-form laminates, including VT-901 polyimide and a full range of IMS materials, on short lead times. And we’re not afraid of hard work!
Starkey: Thanks, Ray, Jack--a final word from you?
Pattie: It goes without saying that our absolute aim is to give the very best in customer satisfaction. Ventec USA’s outstanding reputation for responsive service and technical back-up continues to grow and we pride ourselves on quality and consistency across a very diverse range of laminate products.
Page 2 of 2Suggested Items
The Evolution of Picosecond Laser Drilling
06/19/2025 | Marcy LaRont, PCB007 MagazineIs it hard to imagine a single laser pulse reduced not only from nanoseconds to picoseconds in its pulse duration, but even to femtoseconds? Well, buckle up because it seems we are there. In this interview, Dr. Stefan Rung, technical director of laser machines at Schmoll Maschinen GmbH, traces the technology trajectory of the laser drill from the CO2 laser to cutting-edge picosecond and hybrid laser drilling systems, highlighting the benefits and limitations of each method, and demonstrating how laser innovations are shaping the future of PCB fabrication.
Day 2: More Cutting-edge Insights at the EIPC Summer Conference
06/18/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.