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Point/Counterpoint
December 31, 1969 |Estimated reading time: 3 minutes
Industry experts voice differing opinions on wave soldering vs. laser diode soldering
Wave Soldering
Wave soldering is the primary method for soldering components to circuit boards in both thru-hole and mixed-technology processes because of the high reliability and throughput they provide. Today’s wave soldering machines are more advanced than their predecessors of the ’80s and ’90s, and have evolved for each process advance developed through the years. These advanced wave soldering systems are computer-controlled and monitor each machine function, provide data for each printed circuit board (PCB) processed, are self calibrating and automatically change machine setup for every individual PCB processed. The advantages advanced wave soldering systems provide today are greater than other soldering methods in terms of functionality and flexibility.
New processes and complex circuitry require a tighter control over the soldering functions, which has led to highly developed machine operating software and system monitoring. The operating software for a wave solder today constantly monitors each function as it is being performed, and calibrates and corrects itself, tracking each PCB in real time as it is processed. The machine controls how much and what type of flux is used, the preheat needed for the PCB being processed, the amount of oxygen in the preheat and soldering atmosphere, conveyor speed, the angle of the conveyor to the soldering nozzle, the temperature of the PCB prior to soldering, which soldering nozzle to use and the amount of solder being pumped through the solder nozzle. These advanced wave soldering systems give the operator greater control over the process, as well as allowing users to change to a lead-free solder and maintain current soldering procedures. This is not always possible with other soldering systems.
Flexibility is key in today’s manufacturing world; and advanced wave soldering systems are leading the way. The operating software not only provides for better control and traceability, but also allows for the wave soldering systems to change settings for each PCB processed without stopping production.
Wave soldering is a proven soldering method that has maintained its stature by evolving as needs change. Whether it is a change in solder, flux or soldering pallets for soldering only certain areas of the PCB, wave soldering provides the greatest flexibility for each process step while maintaining consistent high throughput. While there may be some methods that work for a small niche, there really is no substitute for these tried-and-true soldering solutions.
Eric Forg may be contacted at EPM-IBL USA, P.O. Box 953877, Lake Mary, FL 32795; (407) 831-2550; Fax: (407) 831-2560; E-mail: info@epm-ibl-usa.com.
Laser Diode Soldering
Laser diode technology in electronics manufacturing is becoming a highly effective means to selectively solder various products with low- to mid-volume component/connector counts, tight pin-to-pin arrangements or for specialty-type applications. Laser diode technology brings consistency and reliability to the manufacturing process, and is equally precise for both tin/lead and lead-free applications.
The laser diode itself emits a wavelength of light that is transferred through a fiber optic cable into a magnifying lens. The magnifying lens focuses the light to a concentrated point used for soldering. The focused light generates enough energy to solder connections with different heat capacities and solder composition requirements. Some of the benefits of an automated laser diode system include: the ability to customize soldering conditions for each solder connection, quick changeover from one product to the next or from tin/lead to lead-free solders, highly controlled processability and minimal maintenance requirements during production.
With numerous component manufacturers introducing new lead-free components each month, combined with corporate lead-free initiatives, and a mixture of existing customer products, older replacement parts and new product introductions, manufacturers are projected to experience numerous difficulties when soldering both tin/lead and lead-free component types within the same wave or selective wave machines that contain only tin/lead or lead-free solders. Because laser soldering technology works well with both types of solder, tin/lead or lead-free wire spools may be changed quickly, allowing for maximum flexibility when the manufacturing process requires high-mix, low- to mid-volume soldering of multiple solder types within the same line.
Additionally, the selective laser soldering process does not have many of the soft costs generally tied to traditional wave technologies. These costs may include engineering costs associated with designing pallets or masks, the cost of pallets, rework due to solder migration and special care of high-value components. Facility and maintenance requirements also are less.
Selective laser soldering technologies have advanced in the past two years. With the introduction of lead-free initiatives, the intermix of tin/lead and lead-free components within the manufacturing environment and a continued emphasis on process quality, selective laser soldering makes sense for many applications.
Gary Goldberg may be contacted at PRO-MATION INC., 92nd Ave., Kenosha, WI 53142; (262) 942-4177; Fax: (262) 942-0101; E-mail: sales@Pro-mation-Inc.com.