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NEPCON East and Electro Preview
December 31, 1969 |Estimated reading time: 14 minutes
NEPCON East/Electro 2001 Show information NEPCON East and Electro Preview
NEPCON East is an opportunity to get "hands on" experience with innovative design, packaging, fabrication, assembly and test solutions. The conference offers many opportunities for attendees to gain new skills and update technical knowledge, such as product demonstrations, specifications available for review, workshops and more. Electro compliments NEPCON East with "one-stop-shopping" for all needs from active components to wire and cable assemblies. This is a unique opportunity for design engineers to discover new product capabilities and for purchasing managers to identify new sources of supply.
The show floor will be open from 10 a.m. until 5 p.m. on the 12th, and from 10 a.m. until 4 p.m. on the 13th. Conference hours begin Monday, June 11 from 9 a.m. until 4:30 p.m. and remain the same through June 13.
Conference OverviewProviding attendees with answers necessary to remaining competitive in today's market, this comprehensive program features full day courses, half-day workshops, panel discussions and paper sessions, allowing the attendee to develop a program of offerings to meet individual needs. In addition to NEPCON East and Electro, SMTA Boston will be held at the Bayside Convention Center June 11 to 13. Three events comprise SMTA Boston: SMTA's Academy Program, Flip-Fest 2001 and Advanced Packaging Technologies in the Electronics Industry.
SMTA Academy. Held June 11 to 13, the SMTA Academy Program often is referred to as a "mobile classroom" as it visits different cities each year, bringing industry leaders to attendees' doorsteps for training that is specialized according to local interests. The courses developed for the Academy Program address both cutting edge and fundamental topics. Courses offered at SMTA Boston include, "Effective Outsourcing from Decision through Implementation," "New and Emerging Technologies for Electronic Packaging and Assembly," and "Applying SPC to the Surface Mount Manufacturing Line."
Flip-Fest 2001. This one-day event, June 11, will include a half-day workshop on "Flip Chip Assembly and Applications What, Why, How." Following will be an interactive panel discussion in the afternoon bringing together a number of industry leaders including Cookson Electronics, Parlex, FlipChips.com and IBM to discuss the many aspects surrounding flip chip. Topics to be addressed will include advances in flip chip, reliability, flip chip vs. CSP, interconnect technology, underfills, advanced applications and more.
Advanced Packaging Technologies in the Electronics Industry. Two thought-provoking days, June 12 and 13, focus on two of today's most important issues: progress in lead-free soldering and packaging technologies for the telecommunications industry, including Bluetooth. Industry leaders will present 26 papers on topics such as assembly, reliability, conductive adhesives, equipment development and lead-free issues.
The first day of the conference focuses on lead-free soldering technology progress and will consist of two sessions: "Implementing a Lead-free Solder Assembly Process" and "Reliability of No-lead Solder Technology." The second day focuses on packaging technology for the telecommunications industry and will include sessions on "Assembling Telecommunications Products" and "Reliability Aspects of Telecommunications Assemblies."
Special EventsKeynote Address. This free event takes place Tuesday, June 12, at 12 p.m. Presenter Kevin Burns, senior vice president and chief materials officer of Solectron, will address issues driving contract manufacturing and the electronics industry today.
Special Products and Services Forum. During show hours on Tuesday and Wednesday, June 12 and 13, participating companies offer in-depth technical training and product demonstrations in a theater-style setting. Technical and product information is conveyed in a manner that cannot be accomplished in a booth setting. The presentation schedule will be available at the show.
Free Networking Reception. Relax after a busy day at the show or continue unfinished business Tuesday, June 12, from 5:30 to 7:30 p.m. at this free reception sponsored by the ERA New England. Boston's McCormick & Schmick's Seafood Restaurant will host the event, offering free hors d'oeuvres and two free drinks. Free bus transportation will be provided from the Convention Center.
Win Boston Sports Memorabilia. Enter the NEPCON East/Electro drawing for a chance to win unique and valuable Red Sox and Celtics memorabilia. See NEPCON East's Web site for complete details and rules.
For additional information on NEPCON East and Electro 2001, visit www.nepcon.com/nepconeast.
This year, NEPCON East and Electro combine to form the Northeast's comprehensive electronics manufacturing and components event. The show will be held June 12 and 13, 2001, at the Bayside Exposition Center in Boston. More than 400 suppliers will be attending and exhibiting, including National Instruments, Assembly Products, Asymtek, OK International, SCI Systems, Mydata, Loctite, Tharo Systems, Europlacer, Arlink and many more.
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NEPCON East/Electro 2001 Products
Streamlined PCB Assembly ProcessCircuitCAM Line Optimizer module was designed to streamline the process of assigning tasks to various points on a PCB assembly line. The software reportedly balances the line, eliminates bottlenecks and simulates overall throughput, while bypassing the process of manually assigning component population. All data are stored in a Microsoft Access database. The software also calculates optimal component distribution and is said to rapidly take into account more information than a human operator can handle reasonably. Aegis Industrial Software Corp., Horsham, Pa.
AOI System for Pre-reflowKS 100 is an AOI system designed to inspect circuit boards after components are placed and before reflow. The system is said to perform 100 percent inspection and measurement at production line speed, is accurate to 10 µm (0.40 mils) and repeatable to 3 µm (0.12 mils), and comes with a built-in conveyor. Measuring board devices, including components, connectors, labels, logos and polarity marks, reportedly continue collecting data and updating the model, gradually improving performance until the typical false call rate is less than 50. CyberOptics Corp., Minneapolis, Minn.
Automated Device ProgrammerAn automated device programmer, BP-4600 features reported throughput speeds up to 1,200 devices per hour. The system is applicable to devices supported by an automated programmer down to 1.5 V, including Flash memories, microcontrollers and PLDs in packages that range from large QFPs to microBGAs and CSPs. This model and the other 4000 series automated programmers claim to support more than 15,000 devices. Over 160 automated socket modules are available, reportedly allowing users to change package types within five minutes. BP Microsystems, Houston, Texas.
Antistatic TapeThe Wescorp brand of high-visibility, yellow antistatic tape, which has been developed for general-purpose applications, features the "reaching hand" ESD susceptibility symbol, and has a reported temperature range of 10° to 50°C. The markings, the approved symbol of Mil Spec, JEDEC and ESD Association, are printed between the film and adhesive so that they will not rub off. The tape comes in four widths: 0.50, 0.75, 1 and 2". The roll length is 72 yards, with a measured thickness of 0.0024". The rubber-based adhesive claims to absorb moisture and have a surface resistivity of 1010 Ω. ESD Systems.com, Marlboro, Mass.
Automated Program FeederProLINE RoadRunner, an automated programming feeder, is targeted to cellular telephone and other high-volume electronics manufacturers using Flash memory devices. The feeder includes the standard TaskLink for Windows user interface and programming process control software. This generic user interface means that current tasks and jobs already programmed on other systems can be transferred to this feeder easily, with minor modifications. Data I/O Corp., Redmond, Wash.
X-ray SystemJewel Box 90-C reportedly features high resolution and grayscale fidelity. The system's proprietary imaging technology presents a clear image of a 0.001" gold wire through a solder void in a BGA, revealing the wire, void and BGA. Incorporating a 90 kV X-ray source with the company's patented X-ray camera, the system features magnifications of more than 1,000X, depending on the dimensions of the inspected object and its degree of distance from the X-ray source. Glenbrook Technologies, Randolph, N.J.
OvensAs a result of an agreement with SMT-Wertheim, the company offers SMT-Wertheim's 460C and 560C reflow ovens. Equipped with a stainless steel mesh belt to provide vibration-free movement of PCBs, these ovens reportedly process mixed-population boards, including conventional components, flip chips and CSPs without component blow-off. Features include advanced technology in addition to 18 or 22" board processing width, and a patented slot-nozzle system said to achieve heat transfer without dislocating flip chip, CSP and other tiny parts. Manncorp, Huntingdon Valley, Pa.
Linux-based System SoftwareThe latest upgrade of Linux-based system software, TPSys 2.2 includes a generic BGA editor allowing users to edit BGAs onscreen. With the editor, users reportedly can create a large and complex BGA in minutes. The software also boasts several new features, including an improved stepper. Other features include extended information in error messages, graphical component in locate feeder, graphical fiducial mark, improved centering, dual shot centering with high-resolution camera and more. MYDATA automation Worldwide, Peabody, Mass.
Soldering RobotROBOSOL PRO 401P is a four-axis desktop selective soldering robot designed for high-volume cellular manufacturing environments. This robot is said to be capable of both linear and point-to-point selective soldering within an 11.8 x 11.8" soldering area. Optional features include a fume-extraction attachment, nitrogen envelope, safety cover, twin-shuttle system and programming software. PACE Inc., Laurel, Md.
ESD LabelsSaid to be able to withstand the rigors of electronics manufacturing, including high-temperature processes such as wave soldering and infrared reflow, the company's ESD labels reportedly reduce the risk of static-related damage to sensitive electronic components during manufacturing, assembly and packaging. The new labels are an ESD Association-certified solution for companies that must label sensitive electronic components for quality control, item identifications or other applications. Zebra Technologies Corp. Vernon Hills, Ill.
Spray Fluxing SystemEZ-Flux automatic spray fluxing system applies flux to PCBs by using a spray nozzle technology with two-direction spray. An air-actuated traversing mechanism provides motion control at a reported speed of 10 to 15" per second. The system's design reportedly maintains deposition variations of ±15 percent. The spray head delivers flux through a pressurized delivery system with a deposition range of 500 to 3,000 µg per in.2 Features include accommodation of all liquid fluxes, including no-clean, O/A and RMA fluxes, and a standard board width capacity of 1 to 20", with the option of expanding to 24". A dual nozzle is available. Ultrasonic Systems Inc., Amesbury, Mass.
AOI SystemA member of the Optima Series, the 7200 is a post-placement AOI system designed to provide comprehensive defect-detection as well as process monitoring of the SMT component placement process. The system reportedly monitors placement equipment to minimize defects while enabling increased yields with reduced repair costs. Advanced image acquisition and image analysis technology are said to provide component inspection and fault coverage at line speed. Teradyne Inc., Walnut Creek, Calif.
PCB Panel PunchN200 is a top down, air operated punch for singulating tab routed PCB panels individually. An upper and lower matching knife blade is used to pinch the tabs apart. This method reportedly produces less stress on the PCB than a punch and die because the cutting action takes place from both sides. Exact cutting location can be adjusted by turning an adjustment screw, which brings the locating pins to the desired position for cutting a tab at the board end of the material. Features include an adjustable front support table with ESD matting. FKN Systek, Waltham, Mass.
3-D Inspection3D|inspector, reportedly a high-resolution 3-D X-ray inspection and analysis system, is designed for verification and in-depth analysis of single- and double-sided boards using BGAs, microBGAs, flip chips and other high-density packages. The system uses a micro-laminography X-ray system to produce off-line planar system images. Providing up to 240 slices, the system detects shorts and voids, as well as missing vias and misaligned inner layers in PCBs, providing slice-by-slice images of ICs, components, hybrids, inner layers, and vias on PCBs and other devices. phoenix|x-ray Systems + Services Inc., Camarillo, Calif.
Large Board AOIVi-3200 reportedly offers 100 percent inspection of boards to 600 x 600 mm (24 x 24"), with a throughput rate up to 150,000 components per hour. The system verifies component positioning (X, Y and Q), polarity and text, presence/absence; inspects solder paste and joints; and detects bridges. With the ability to perform 3-D inspection, the system also is able to verify insufficient or excessive paste deposition on the pads, preventing dry joints, bridging and tombstoning during reflow. Features include a reported system accuracy of ±10 µm, repeatability of ±5 µm at 6 S at speeds up to 2 m per second (80" per second). ViTechnology LLC, Haverhill, Mass.
High-resolution X-rayBGA Buster 2000 is an inspection system reportedly offering precise, rapid analysis of solder integrity on densely populated PCB assemblies. The system is equipped with an enhanced version of the company's image processing software for high-quality, real-time X-ray images. Features include an 18 x 24" X-Y travel for samples up to five pounds in weight, and the ability to be upgraded to programmable motion for automated or semiautomated inspection. CR Technology, Aliso Viejo, Calif.
ESD-safe PCB RackA new model of the company's RA-14 Rack-All is molded in static dissipative material with a surface resistivity of 104 to 105 Ω per cm. The RA-14C measures 14 x 6", weighs 2 lb and features 25 slots measuring 0.180 x 0.333" on a 0.500" pitch. Features include undercut rack ends for transport ease and drainage holes for possible liquid immersion. Fancort Industries Inc., West Caldwell, N.J.
Thermally Conductive SiliconeA new thermally conductive silicone adhesive, Loctite 5405 reportedly cures in 10 minutes when exposed to 150°C heat. The single-component, zinc-oxide filled, heat curable silicone cures to a flexible, electrically isolating material. Capable of producing a thin bond line, the adhesive can bond the die to the lid in applications requiring compliant materials that do not induce stress. The silicone is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. Loctite Americas, Rocky Hill, Conn.
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NEPCON East/Electro 2001
AACL Staticide - 2826AK Stamping Globe Manufacturing Sales Inc. - 2333APT - 2832ASC International - 3338ASG-Jergens Inc. - 3300Absolute Clarity & Calibration LLC - 2500Accumetric LLC, John W. Blair Div. - 2626Accurate Fasteners - 2527Adhesive Packaging Specialties Inc., Tech Film - 2311Advantage Plastic Products
BBP Microsystems - 3401Beamworks - 2428Becker Pumps Corp. - 2528Brainin Advance Industries - 2416Brenner Technical Sales Inc. - 2709Brick Container Corp. - 2833Brother International Corp./OEM Gear Div. - 2516Brownsburg Electronik - 2531
CCR Technology - 3414Cab Technology Inc. - 3102Cabletest International - 3431Carpenter Manufacturing Co. Inc. - 2341Chang Sung Corp. - 2715Chomerics, Div. of Parker Hannifin Corp. - 2912Chungchong Nam-Do Provincial Government - 2634Cincinnati Sub-Zero Products Inc. - 3234Circuit Technology Center Inc. - 2511Cirris Systems Corp. - 3328Classic Components Corp. - 2414Com-Kyl - 2523Conductive Containers Inc. - 2822Contact East Inc. - 2801Contact Electronics - 2611Converters Inc. - 2313Cooper Tools - 2637Crystal Mark Inc. - 3305Custom Assemblies Ltd. - 2815CyberOptics Corp. - 2507
DData Circuit Systems Inc. - 3203Data I/O - 3109Datapaq Inc. - 2717Desco Charleswater
EEMC Global Technologies Inc.- 2737Emsr (Engineering Management) - 2448EPC Identification Systems - 2718EPT Inc. - 2633ESD Systems - 2542E-Tool - 2925Eastman Kodak Co., Motion Analysis Systems Div. - 3417Electronic Exporters Group - 2623, 2625, 2726Electropac Co. Inc. - 2535Ellsworth Adhesive Systems - 2653Emulation Technology Inc. - 3327Ersa Inc. - 2508Essco Calibration Laboratory - 3513Eubanks Engineering Co. - 2856Excelta Corp. - 2318
FFKN Systek Inc. - 2526Fancort Industries Inc. - 2728FeinFocus USA Inc. - 3503Fielding Manufacturing - 3410Fipa Tunisia - 2544Fishman Corp. - 2423Fuses Unlimited - 2747
GG.C. Aero - 3311GTR Manufacturing Corp. - 2725Gary Plastic Packaging Corp. - 2834Glenbrook Technologies Inc. - 2817Global Automation Inc. - 2506Gordon Brush Manufacturing Co. Inc. - 2618Greene Rubber Co. Inc. - 2411
HHanel Storage Systems - 2437Hardware Specialty Co. Inc. - 2104Harvard Custom Manufacturing - 2517Hepco Inc. - 2742Hi-Scope Systems Co. - 3438High-Tech Conversions Inc. - 2206
IIKO International Inc. - 3216ITT Industries A/CD - 2317Ideal Industries Inc. - 2438IDENTCO - 2818Impell Purification Tech - 2418Industrial Labeling Systems - 2910Instrumentation Engineering - 3329Insulfab Plastics Inc. - 2643Interconnect Systems Inc. - 3100Interflux Electronics Inc. - 2808Itronics Corp. - 3500ITW Chemtronics - 2723
JJSC Wire & Cable - 2657JTAG Technologies - 3304
KKomax Corp. - 2547Kyzen Corp. - 2852
LLeister Process Technologies - 2617Liquid Control Corp. - 2605Loctite Corp. - 2647Lucent Technologies Electroplating Chemicals & Services
MM.A.D.S. Inc. - 2512MSD Microelectronic Systems Distributors - 3301, 3404Manix Manufacturing Inc. - 2846MannCorp. - 2757Metcal - 2306Micro Care Corp. - 3507Mid America Taping and Reeling Inc. - 3501Montrac LLC - 2714Mouser Electronics - 3439MYDATA Automation Inc.
NNational Instruments - 3409Nichimen Corp. - 2918Nicolet Imaging Systems/Sierra Research & Technology - 2851Northeast Representatives Inc. - 2107NOVASTAR Technologies Inc. - 2837Nu-Concepts Systems - 2534Nuvisions Manufacturing Inc. - 3231
OO.C. White Co. - 2638Oneida Research Services - 3420
PPRF USA Inc. - 2751PACE Inc. - 2836Pacific Scientific - 2727Pad Print Machinery - 2710Panel Components Corp. - 3309Penn United Technology Inc. - 3335phoenix|x-ray Systems + Services Inc. - 3320Plato Products Inc. - 2537Pro-Line - 2351Production Basics - 2735Production Industries Inc. - 2646Proto Part - 2906Public Service of New Hampshire - 2813PX Instrument Technology - 3511
QQA Technology Co. Inc. - 3222Q-Fab - 2711Qualectron Systems Corp. - 2442Quantum Storage Systems - 2753
RRNS International Inc. - 3418R&D Circuits Inc. - 3314Racal Instruments Inc. - 3202RadioShack.com Commercial Sales - 3316Rematek Inc. - 3430Rochester Institute of Technology/Center for Electronics Manufacturing & Assembly- 2629Royonix Inc. - 2522
SSCI Systems Inc. - 2734S. P. Precision Int'l Ltd. - 2607Samsung Aerospace Ind. Ltd. - 2937Sandvik Lindstrom - 2417Schleuniger Inc. - 2758Screening Systems Inc. - 3415Sea View Technologies Inc. - 2748Sealant Equipment & Engineering Inc. - 2701Semiconductor Equipment Corp. - 2752Separation Technologists - 3200Siemens Energy & Automation Inc.Electronics Manufacturing Center - 2850SmartMove Conveyors Group Div. of Precision Handling Devices - 2802Sonic Connections - 3408Specialty Photo-Etch Inc. - 2705Static Control Components Inc. - 2806Static Solutions Inc. - 2805Static Technologies Corp. - 2750Surface Mount Techniques - 2120
TTHK America Inc. - 2543TÜV Management Service TÜV Product Service - 2730Taitronics Inc. - 2613Tampa Bay Partnership - 2307T-Tech Inc. - 2754Tech Spray Inc. - 2342Techco (Pte) Ltd. Woodlands East Industrial Estate
UUltrasonic Systems Inc. - 2227United Technical Products - 2731Unitek Equipment - 2622
VV-TEK Inc. - 2513VEMAS - 2713Viscom Inc. - 3419Vision Engineering Inc. - 3215ViTechnology LLC - 2223Volk Packaging - 2749
WWaveRoom Plus - 2708Wiha Tools - 2716Winslow Automation Inc. - 2632
ZZebra Technologies Corp. - 3101Zephyrtronics - 2218
Exhibitor's list final as of press time.