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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
May 24, 2024 | Nolan Johnson, I-Connect007Estimated reading time: 3 minutes
![](https://iconnect007.com/application/files/9816/9086/9878/Top5_picks.jpg)
Recently, I was reading a report from Deloitte on the Mexican economy (and don’t judge me what I read while I wait my turn at the gym). This particular report is cited in an interview scheduled for the June 2024 issue of SMT007 Magazine. I made note of a few things.
The construction of industrial facilities in the country has grown 19% in the first six months of 2023, compared to the same period last year. Factories within Mexican border can affix the “Made in Mexico” label on their goods and pay zero duty on a large number of products exported into the U.S. Since March 2022, Mexico is now the largest commercial partner of the United States, passing China.
The authors are quite clear in their conclusions: “Mexico is a manufacturing country, and more importantly, it is a reassembler. It imports intermediate goods that it transforms into semifinal or final products, which are then largely exported. This phenomenon is quite significant in Mexican commerce, as manufacturing exports represent almost 90% of total exports, while non-oil intermediate imports represent 70% of total imports.”
We’ll be looking at the changing EMS landscape in the upcoming issue of SMT007 Magazine, and the dynamics in Mexico make for a great case study. That issue will publish in early June. Until then, here are my picks for the top news items of the past week, all of which report on fundamental shifts to the landscape of our industry.
DuPont Announces Plan to Separate into Three Independent, Publicly Traded Companies
Published May 23
DuPont announced a plan to separate into three distinct, publicly traded companies. New DuPont will be a premier diversified industrial company powered by deep materials science and application engineering expertise, industry-leading innovation, top-tier manufacturing capabilities, and iconic brands such as Tyvek®, Kevlar® and Nomex®. New DuPont will have a strong presence in fast-growing healthcare end-markets including applications for biopharma consumables, medical devices, and medical packaging. As independent entities, both Electronics and Water will benefit from increased focus and agility in their respective industries. At separation, each of the three companies will have strong balance sheets, attractive financial profiles and compelling growth opportunities.
Real Time with… IPC APEX EXPO 2024: Unveiling the New Chief Strategist of Advanced Packaging at IPC
Published May 21
As IPC's new chief strategist of advanced packaging, Devan Iyer shares his industry experience and the objectives of his role and emphasizes the necessity for solid standards and guidelines for new packaging technologies and design methodologies. He also highlights the significance of diverse package technologies. This is one to keep an eye on as IPC leads the conversation on this topic.
Scalable ZLD and a Solution for PCB Start-ups
Published May 23
Alex Stepinski continues to share his innovative thinking and design insights in developing manufacturing processes that deliver on ecological sustainability goals. In this interview, Stepinski discusses his Zero Liquid Discharge systems, and his concerns for the global PCB fabrication industry. You can always count on Alex to keep the industry moving forward.
China Retains Market Advantage in Battery Development Despite U.S. Raising Tariffs on Chinese Battery Imports to 25%
Published May 23
Trendforce reports that in the short term, increased tariffs and IRA regulations underscore the growing geopolitical influence on the EV industry. U.S. automakers can mitigate these impacts by partnering with established battery makers from Japan and South Korea or investing in solid-state battery technology. In the long term, scaling up EV sales to achieve economies of scale is crucial for reducing battery costs.
IBM to Acquire Octo
Published May 20
IBM announced an agreement to acquire Octo, a U.S.-based IT modernization and digital transformation services provider exclusively serving the U.S. federal government, including defense, health, and civilian agencies. IBM's acquisition of Octo establishes one of the largest digital transformation partners to the federal government. This acquisition speaks to the increased strategic importance of data management and digital transformation to all industry, not solely electronics manufacturing.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/14/2024 | Nolan Johnson, PCB007This week’s must-reads are comprised of news which moves the industry forward. We’ve had quite a lot of news on a global scale, and they’re all good reads. To winnow down to just five, I chose either new information or interesting takes on ongoing industry stories. To that end, we have news about new capital equipment for advanced packaging, discussions of material selection and the imaging process during PCB fabrication, a columnist's ode to the best engineer she knows, and some optimistic news from the semiconductor industry.
Technology Days 2024 at Rehm: #opentochange
06/14/2024 | Rehm Thermal Systems“The only constant is change” – this is particularly true in electronics manufacturing. In an industry that is constantly evolving and changing, it is crucial to be open to change.
IPC Masters 2024 Aims to Enhance Operator Skills in China
06/14/2024 | IPCTo meet the needs of China's electronics industry, IPC Asia and Pudong New Area Association For Quality And Technology Shanghai, will jointly organize a comprehensive skill competition event called IPC Masters 2024 in Shanghai, China.
Creation Technologies Celebrates 25 Years of Membership with SMTA
06/13/2024 | SMTAAt Creation Technologies, we’re thrilled to celebrate a significant milestone: 25 years of membership with the Surface Mount Technology Association (SMTA).
IPC Hosts Advanced Packaging Symposium in Tokyo
06/13/2024 | IPCThe IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping the future of advanced packaging technologies.