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New Products
December 31, 1969 |Estimated reading time: 28 minutes
FEATURE PRODUCTSCircuit Assembly MaterialsCircuitSAF line of circuit assembly materials includes surface mount adhesives, thermally conductive materials, glob-top encapsulants, cavity/dam encapsulants, flip chip underfill encapsulants and silver-filled adhesives. The materials are designed to increase manufacturing speed, productivity and reliability. Reportedly, they were engineered to be compatible with leading-edge manufacturing processes and are available in a wide variety of packaging to accommodate advanced delivery techniques and equipment. Thermoset, Lord Chemical Products, Indianapolis, Ind.
Film AdhesivesThese preforms and film adhesives are pre-dispensed on carrier sheets, continuous rolls or preforms to the manufacturers' specifications. Once the film adhesive is applied to one component or substrate, the carrier sheet is removed and another component reportedly can be mated. The application process is said to be accurate from part-to-part and lot-to-lot. The adhesive is heat activated to produce a uniform bond and reportedly is free of squeeze-out and undesirable contact between substrates and components. APS TechFilm, Peabody, Mass.
X-ray InspectionThe Jewel Box 90-C is said to feature the highest resolution and gray-scale fidelity of any real-time X-ray inspection system on the market. Its proprietary imaging technology reportedly presents a clear image of an 0.001" gold wire through a solder void in a BGA, revealing the wire, void and BGA. The system incorporates a 90 kV X-ray source with a patented X-ray camera. The geometry of the high-voltage X-ray source allows objects being inspected to be placed in close proximity to it. Depending on the dimensions of the inspected object and its degree of distance from the X-ray source, magnifications of more than 1,000X reportedly are achieved. Glenbrook Technologies Inc., Randolph, N.J.
Tray HandlingDesigned for easy integration and stand-alone operation, the Automated Tray Handling System for 136 x 316 mm standard JEDEC trays is said to take up minimal space. Parts in trays to be processed are stacked on the upper elevator platform by the operator. The system then automatically picks off the top tray from the upper elevator platform and presents this tray to the host system. Once parts processing is complete, it places that tray on the top of the stack of the lower elevator platform. Pro Automation Inc., Garden Grove, CA.
Industrial Machine Vision SensorIn-Sight 2000 is an industrial machine vision sensor that provides vision technology in a stand-alone package that reportedly requires no programming or PC. It is said to bridge the gap between single-purpose "smart cameras" and general-purpose machine vision systems that are higher in price. The product reportedly is the first vision product to employ a spreadsheet for configuring vision applications, thereby eliminating the need for complex programming or relying on an external PC for setup. Cognex Corp., Natick, Mass.
Thick Film CoatingReportedly curing in seconds upon exposure to UV/visible light, 9-20558 is said to adhere to Kapton. The cured coating forms a transparent layer designed to protect underlying circuitry and components from moisture, dust and other contaminants. The coating viscosity is said to be formulated for precision-dispensing systems. Controlled placement of the coating reportedly optimizes the process and minimizes resin consumption. Dymax Corp., Torrington, Conn.
ADHESIVES/EPOXIESEpoxy Adhesive120-32 is a syringe-dispensable, B-stageable, electrically conductive, one-part epoxy adhesive that is said to be suitable for dipping and syringe-dispensing. The curing schedule for this product reportedly can be as low as 1 to 2 minutes at 200°C or 2 to 3 minutes at 185°C. This system is said to feature thermal stability and high-temperature properties. Applications include, but are not limited to, assembling electrical and electronic components; bonding capacitors to lead frames; and bonding SMDs to rigid PCBs. Creative Materials Inc., Tyngsboro, Mass.
Thermally Conductive Epoxy3860 is a medium-viscosity, low-shrinkage potting material that is said to offer wetting and flow capabilities, thermal-shock resistance, high heat-transfer capabilities, and electrical properties. When fully cured, this potting material reportedly is resistant to weather, moisture, gases and vapors, petroleum-based contaminants, and many mild acids and alkalis. The product cures in 24 to 48 hours at room temperature. Loctite Corp., Rocky Hill, Conn.
Lead-free AlloyLF218 is a ternary alloy made up of 96.2 percent tin, 3 percent silver and 0.8 percent copper. It is said to be similar in composition to Castin, a lead-free alloy for electronics assembly operations, except without the melting temperature reducing and grain defining dopant used in the other alloy. This alloy reportedly offers the advantages found in the tin/silver/copper family of alloys, including thermal and mechanical reliability, a relatively low melting temperature (217° to 218°C), part and process compatibility, and wide availability. AIM, Montreal, Canada.
Epoxy FormulationEmcast 4180 is a single-component, fast-curing, electronic-grade epoxy formulation. This room-temperature-stable epoxy is said to have a fast elevated temperature cure schedule. Its viscosity and thixotropy reportedly have been developed to meet the needs of coating or encapsulating semiconductor devices on electronic PCBs. The epoxy can be applied using a pneumatic powered syringe and offers adhesion to various substrates. Electronic Materials Inc. (EMI), Breckenridge, Colo.
EpoxyPolymer adhesive EP30-3 is a high-temperature-resistant, optically clear, low-viscosity epoxy adhesive, sealant and encapsulant. This two-component system is said to have a noncritical 100-to-30 mix ratio by weight and a service operating temperature range of -60° to 435°F. It reportedly offers high-strength bonds to both similar and dissimilar substrates, as well as adhesion to metals, glass, ceramics, wood, vulcanized rubber and many plastics. Master Bond Inc., Hackensack, N.J.
Epoxy AdhesiveScotch-weld epoxy adhesive DP-460 EG reportedly will cure in 24 hours at room temperature and is suitable for potting, rigidizing and a range of assembly options. Heating is said to accelerate the cure and can result in a higher sheer-and-peel strength. Stored at 60° to 80°F, it has a shelf life of 12 months in its original container. 3M Adhesives Div., St. Paul, Minn.
ASSEMBLY EQUIPMENTLead-forming SystemsFlat Pack Surface Mount Lead-forming Systems are designed to help circuit assemblers and component manufacturers keep ahead of the growing diversity in IC and ASIC packaging. The FP-5 prepares components for surface mount assembly, including 320-lead ICs on fine-pitch, 0.020" centers. The system comprises a compact press and interchangeable dies that make bends and burr-free cutoffs on QFPs, PQFPs or CQFPs. Manix Manufacturing Inc., Huntingdon Valley, Pa.
DepanelizerThe K3000L linear blade PCB singulator is designed to depanelize skip-routed PCBs up to 24" long. These manual PCB depanelizers are available in two versions. Users place the bottom scoreline of the PCB onto the linear blade and pull the circular blade across the top scoreline to cleanly separate the PCB panels. An adjustable front and back table can be tilted so that separated panels can slide onto an assembly line. FKN Systek Inc., Waltham, Mass.
Drill-tool MonitoringIn Electric Field Sensor (EFS) technology, the drill bit functions as a microwave antenna and sets the zero point upon first contact with the conductive PCB surface. Accuracy of 0.0002" is said to be achievable, unencumbered by surface debris, variations in panel surface, adjacent burrs or spindle warm-up. Also, because EFS technology is based on microwave energy, the maintenance associated with optical broken-tool detectors is eliminated. Excellon Automation Co., Torrance, Calif.
Laser Circuit Board CutterSL-3020G laser circuit board cutter is designed to cut or score both fiber and ceramic PCBs. The system uses a 532 nm wavelength Nd:YAG laser to perform the cutting operation in conjunction with a high-performance flying optics motion system. This reportedly means that boards remain stationary throughout the operation, making it suitable for conveyor pass-through or static-fixturing operations. The laser tube incorporates an LBO crystal to convert a standard Nd:YAG 1,064 wavelength to its second harmonic. Online Inc., McHenry, Ill.
PCB SeparatorSmall PCBs usually are combined to form a larger panelboard. The single PCBs often are separated by a routed slit and only connected by a nib. The NTM-R machine was designed to remove this nib without leaving any remainder and without damaging either PCBs or components. Special knives center the panels when they are inserted into the machine with the routed slit. According to the nib's position, the knives can be continuously adjusted in longitudinal direction. Fancort Industries Inc., West Caldwell, N.J.
HandlerMP100 is a component-handling system that is designed to handle small-form-factor packages via bulk input. It tests, inspects and puts packages into tape at throughputs that reportedly reach 5,000 parts per hour. The system's bulk-input functionality uses a vibratory-bowl technology. Specially designed bowls are said to maximize input speed and ensure proper feeding and orientation, regardless of component size. The system supports a range of packages. Ismeca USA Inc., Vista, Calif.
Technical WorkbenchesThis line of modular ESD technical workbenches features an enhanced welded-leg design that is said to improve durability and overall aesthetics. The benches are available with ESD work surfaces and paint to meet specific electrical-property requirements, reportedly ensuring static dissipation at a safe rate. Suitable for assembly, test and repair, maintenance, and laboratory applications, the workbenches are said to be ergonomic and offer flexibility. Lista International Corp., Holliston, Mass.
In-line ProgrammingThe ProLine RoadRunner is designed to enable electronics manufacturers to eliminate device programming bottlenecks in their production lines. This in-line programming solution employs an "on-line" concept, meaning it attaches directly to the feeder bank of the assembly machine in a production line. This reportedly enables cell-phone and high-volume electronics manufacturers to program and deliver Flash memory devices or ICs directly to the assembly machine for just-in-time programming without any changes to existing production lines. Data I/O Corp., Redmond, Wash.
Automated Ribbon Bonding InterconnectsModel 2470-V performs ribbon wire bonding to interconnect microstrip transmission lines, wave guides, and passive and active components that operate in higher frequency ranges. Ribbon bonding, a more robust process than other wedge-bonding methods, is said to be more delicate to bonding pads and carry higher current while minimizing impedance and inductance. The rectangular-shape wire is said to offer consistent loop profiles. Palomar Technologies, Vista, Calif.
Power SuppliesThe TruPulse family of resistance microwelding power supplies reportedly delivers capabilities for short-pulse, high-precision applications. Model MP Production Series is available in 1,000, 2,000 and 4,000 A versions, all of which feature closed-loop linear DC technology with adaptive feedback for maintaining energy delivery. Users may select modes for controlling all variables to a constant setting of voltage, current or power. Microjoin Inc., Poway, Calif.
Sine Encoder OptionThis high-resolution sine encoder option for the Platinum DDL (Direct Drive Linear) frameless permanent magnet brushless servo motor typically is used for inspection, pick-and-place machines and gantry systems. The sine encoder option reportedly provides position information to the drive in the form of analog sine/cosine signals. The drive then decodes the sine into a fine resolution. Kollmorgen, Radford, Va.
Tooling SolutionThe FormFlex tooling solution provides support across the entire underside of the board and stencil during the printing process, reportedly protecting delicate components and improving print quality. The system does not require any programming and minimizes intervention for tooling setup. It also uses pins to provide support automatically in the X, Y and Z planes across the entire underside, including components and stencil as well as the board. DEK USA Inc., Flemington, N.J.
CLEANING MATERIALS/EQUIPMENTUltrasonic Stencil Cleaning SystemThe AquaSonic ultrasonic stencil cleaning system AQS-7000 is a stencil cleaner that is said to offer increased process control and cleaning performance. It features a touch-screen operator interface that allows operators to control machine operation, including the automatic-lift assembly, wash time, rinse time, drying time, and percentage of cleaning power and heating. All process parameters reportedly can be programmed, stored and recalled for automatic setup and repeatable cleaning performance. This product is said to clean stencils, misprinted boards, printing tools, dispensing nozzles, squeegee blades and other accessories. JNJ Industries, Milford, Mass.
Aqueous Cleaning SystemThe CBW-218 OmniJet aqueous cleaning system is for the electronics assembly and semiconductor packaging industries. It is said to feature all stainless steel (polished) construction, sustained high-solution heat capability, high-volume "EDM" spray bar with greater gpm concentration per square inch to clean densely configured boards, and a convection-type dryer with adjustable blow-off knives that produce water-strip action. Stoelting Inc., Kiel, Wis.
Aqueous Cleaning AgentVigon SC 202 is a water-based cleaning agent used to clean stencils, misprints (populated or unpopulated) and electronic assemblies in the same equipment. Said to be characterized by cleaning ability, a long bath life and an HMIS rating of 0-0-0, the agent originally was developed to clean misprinted boards that had already been soldered on one side. It reportedly is biodegradable, halogen-free and nonflammable. Zestron Corp., Ashburn, Va.
Stencil CleanerThe newest addition to the company's family of cleaning chemistries is the Hydrex line of stencil cleaners. Hydrex AC, Hydrex A-Plus and Hydrex SP are VOC-free/compliant, neutral pH, aqueous cleaning agents. They are said to be aggressive, nonflammable detergents formulated to remove raw solder pastes and uncured SMD adhesives from stencils and misprinted PCBs. This line reportedly was developed to offer an environmentally friendly, safe aqueous cleaning system. Alpha Metals, Jersey City, N.J.
Hand-spray SystemST502 self-contained hand spray/sink/water reclaim system, part of the AquaCycler line of closed-loop recycling systems, has been redesigned. It provides 1 to 3 gpm of deionized water for hand cleaning electronic parts and assemblies, fixtures, small stencils, and more. The high-pressure spray of hot deionized water reportedly cleans and rinses parts, providing a spot-free rinse. It is suitable for rework, prototype and post-cleaning operations. Separation Technologists Inc., Methuen, Mass.
Brush AttachmentThis Brush Attachment is said to offer a rugged, staple-set natural bristle suitable for use in hand, benchtop cleaning and rework applications. It is included with the company's full line of 4 or 6 oz defluxers. Defluxing brush attachment allows for solvent flow through, which reportedly aids in the removal of stubborn RA, RMA and no-clean fluxes. The brush is said to be convenient and simple to use as well as minimize solvent use and improve cleaning. Techspray Inc., Amarillo, Texas.
In-line Aqueous CleanerThe Nu/Clean Galaxy is an in-line aqueous cleaner for low to moderate production runs. This compact machine includes features such as an 18" process width, anti-dragout air knife, 10 spray bars with 74 nozzles and up to 10 hp in blowers to ensure that boards are dry. Technical Devices Co., a subsidiary of Winther Technologies Inc., Torrance, Calif.
Cleaner/ConditionerThis acidic, nonetching cleaner was designed to clean copper and solder surfaces in selective solder-stripping processes. Select Cleaner/Conditioner is said to clean both inorganic and organic soils, removing oxidation from copper without tarnishing solder. The low-VOC-content product reportedly is effective in both soak and spray applications, and contains no chelating ingredients or chlorides. RBP Chemical Corp., Milwaukee, Wis.
Aqueous DegreaserFeaturing a range of soil-removing capabilities, D-Greeze GL55 Aqueous is designed as a high-performance replacement for solvents. It can be used at room temperature or heated and reportedly works with most existing aqueous equipment, including parts washers, ultrasonic and immersion tanks. It cleans soils such as lapping compounds, lard oils, drawing oils, hydraulic oils, hub-wheel bearing greases, waxes, polishing compounds and flux. Solvent Kleene, Peabody, Mass.
COATING/DISPENSING EQUIPMENTCustom Dispensing NeedlesEasy Release custom dispensing needles are designed for precise, repeatable application of encapsulation and underfill material. Each needle is precision-machined from solid stainless steel. Internal profile is said to enhance material flow and consistency, and the chamfered needle tip is ground in a conical direction to allow for better material release. Encapsulation needles reportedly have the standard conically chamfered tip, and underfill needles have a "relieved" tip that allows the needle to be next to the chip for better wicking action. DL Technology LLC, Haverhill, Mass.
Needle ValveThe 740MD-SS MicroDot needle valve is designed to apply extremely small, precise amounts of adhesives and other fluids used in PCB and electronics assembly processes. It seats the needle in the hub of the dispensing tip instead of the valve body. The design is said to reduce the amount of dead fluid volume between the valve seat and the substrate. Valvemate 7000 is designed to control valve operation and allows valve open time to be adjusted in 0.1, 0.01 or 0.001 second increments at the dispensing station. EFD Inc., East Providence, R.I.
Gantry TablesThis line of three-axis XYZ gantry tables is new to the company's automated fluid-dispensing products. The offering includes two entry-level models with stationary work platforms. The TS3030 uses stepper motors and offers a 300 x 300 mm work area. The larger TS4545 uses servo motors and offers a 450 x 450 mm work area for larger dispensing operations. Both models are available with two gantry heights: standard and "X" (extended) versions, providing greater clearance for larger parts. Techcon Systems Inc., Garden Grove, Calif.
Dispensing RobotWhether dispensing epoxies, silicones, inks, solder pastes, adhesives, fluxes, greases, lubricants, potting compounds or other materials, the fully automatic, benchtop 500-LN robot is said to allow dispensing in any sequence of dots, circles, arcs and lines. It is equipped with ready-to-use dispensing software, teach pendant and memory card. Mounting hardware, which allows for dispensing barrel, valve or cartridge mounting to the robot's Z axis, also is available. I&J Fisnar Inc., Fair Lawn, N.J.
COATINGS/ENCAPSULANTSPolyurethane CoatingMetrethane 4763 is said to be a low-VOC, single-component, repairable, flexible, rapid-drying, moisture-resistant polyurethane circuit-board coating. It reportedly meets the low-VOC requirements listed in the recent EPA Air Regulations. The product can be used wherever a high-performance coating is required for maximum environmental protection. This coating's properties include fast-drying, tack-free three hours; high-gloss "walk hard" coatings (floor coatings); moisture resistance; abrasion resistance; electrical insulating properties; and is repairable. Mereco Technologies Group Companies Inc., West Warwick, R.I.
RTV Silicone EncapsulantThe 255 Primerless Elastomer is designed for auto-dispensing and high-speed production. The flowable silicone liquid is said to adhere quickly to various substrates and cure at room temperature. With a viscosity of 5,000 cps, the material reportedly dispenses easily and penetrates between complex component shapes. The two-part formulation offers wetting and adhesion to protect sensitive electrical/electronic devices from moisture, corrosion and subsequent failure. Dow Corning Corp., Midland, Mich.
Spray Fluxing SystemThe Opti-Flux spray-fluxing system is designed for precision application of flux to PCBs. It is said to improve the no-clean process by depositing the proper flux amount needed to facilitate soldering. Self-adapting and programmable, it reportedly can meet any process parameter, including board size, conveyor speed, flux type and deposition amount. The spray is produced with Ultra-Spray technology, which uses a solid vibrating titanium surface to atomize the flux. Ultrasonic Systems Inc., Amesbury, Mass.
Spray NozzlesProMax QuickJet spray nozzles are said to incorporate several new design features, including easy-grip spray tips, a locking design to ensure correct placement of the spray tip and an internal O-ring seal that reportedly remains attached to the spray tip to prevent accidental loss or misplacement. The nozzles have a two-part assembly with a spray-tip design that allow tip changing without tools. They are available with flat, full or hollow-cone spray tips. Spraying Systems Co., Wheaton, Ill.
Reworkable UnderfillsWith the Hysol FP6000 Series of underfill encapsulants, component removal and repair reportedly can be handled using standard rework equipment. These user-friendly materials are said to require no manual steps. Underfilled CSP and BGA assemblies can be repaired. The encapsulants exhibit flow properties, fast cure, and adhesion to flexible and rigid circuit and package substrate materials. Dexter Electronic Materials, Industry, Calif.
Epoxy EncapsulantThis epoxy encapsulant is said to exhibit mechanical shock resistance and damping properties to protect stress-sensitive components. Stycast 1365-65 is a two-component epoxy that reportedly offers Shore-D hardness, more than a four-hour pot life and low viscosity. A soft-gel encapsulant, it reportedly enables manufacturers to inspect and repair or replace embedded components. Emerson & Cuming, a National Starch & Chemical Co., Billerica, Mass.
ENVIRONMENTAL PROTECTIONEnvironmental ProductsThe Environmentally Friendly EF product series is designed to bridge the gap among high performance, standard processing and concerns about bromine in the environment. Products reportedly meet or exceed UL 94V-0 requirements. Additionally, at least one of the new products will be compatible with the higher soldering temperatures of most lead-free solutions. Park/Nelco, Anaheim, Calif.
Vertical-flow Component SystemThe VFCS Vertical-flow Component System is a portable unit with steel tubular legs that supports a 2 x 4' MAX 9000 Ceiling Filter Module. The module is said to supply Class 10 to Class 100 air, at 840 CFM, by means of a HEPA filter that reportedly is 99.99 percent efficient on particles of 0.3 mm or larger. The module supply air is pre-filtered through a 1" dust guard that is 30 percent efficient N.B.S. The system design, which includes a frame, the ceiling modules, lights and a vinyl curtain, sets up on-site without the need for special tools. Liberty Industries Inc., East Berlin, Conn.
Fume-extraction SystemThe 8000/2000 fume-extraction and purification system is said to have a vacuum pump that is rated at 3.4 kW, which means that it can create a higher-pressure vacuum. This reportedly translates into longer filter life. The filter life also can be extended by the use of a large, vertical in-line filter, available as an optional unit that fits under the main extraction machine. Measuring 19.250 x 27.250 x 24.250", this is twice as large as the company's previous systems. Purex North America, a Div. of Hi-Tech UK, Anaheim, Calif.
INSPECTION EQUIPMENTAOI SystemThe Automatic Optical Inspection System for in-line PCB assembly uses a software platform for image analysis and programming from CAD files or prototype board. Using a combination of angled strobe lighting and lasers, the system reportedly can perform full-board solder-paste inspection for 2-D and 3-D coverage, after screen printing with accuracy. The system also can inspect for component presence, polarity, skew and placement parameter evaluation, including reading component markings for both pre- or post-reflow applications. Leica Microsystems Inc., Deerfield, Ill.
Laser Measurement SystemThe LK Series CCD laser displacement meter is said to be a high-accuracy, semiconductor laser-based triangulation measurement system with 1.0 mm resolution and a ±1 percent F.S. linearity. Designed for surface profiling, thickness measurement, height, width, position and size of metals and other materials, it reportedly provides accuracy that is unaffected by target color, surface texture or stray light for applications.It is available in a high-accuracy Model LK-031 (30 ±5 mm range) and a long-range Model LK-081 (80 ±15 mm range). Keyence Corp. of America, Woodcliff Lake, N.J.
Scanner/VerifierThe HawkEye Model 15HD fixed-position scanner and verifier is said to feature QuicSet integrated visual-laser targeting with audio feedback, so line operators can align the machine on bar- or matrix-code symbols without any external equipment such as a PC or video monitor. With this system, production line changeover and in-process adjustments reportedly can be made without trial-and-error testing. Developed for PCB and other electronics-industry applications, this machine can read standard printed labels and laser-etched direct marks that are low-contrast. Auto Image ID, Cherry Hill, N.J.
Programming StationNew to the AutoInspector series is the AutoTrainer off-line programming station for PCB inspection. It handles the programming, fine-tuning and backing up of databases while the main program is dedicated to the production line. Designed to boost productivity, this station performs programming functions off-line in a networked environment by emulating it on a workstation. Machine Vision Products (MVP), Carlsbad, Calif.
Laser Height SensorThe CCD non-contact laser height sensor for the Millennium Series M-2000 system is designed to provide high-speed dispense height measurement for delicate substrates, hybrids and ICs that may be compromised by tactile sensing. The unit's high-speed light-processing capability is said to accommodate variations in substrate finish, including rough, dark and mirrored surfaces, for enhanced throughput and greater yield. Asymtek, a Nordson Co., Carlsbad, Calif.
Robot SystemThe RIS 1000 robot inspection/dispense system reportedly uses a high-accuracy cylindrical robot for positioning components for inspection. The robot can be configured for dispensing epoxy in X, Y and Z. Chipscale Robotics Inc., San Jose, Calif.
Machine Vision BoardsPC-LineScan is the first in a series of high-performance frame grabbers that is said to provide on-board acceleration for high-speed vision tasks. Designed for challenging line-scan applications, the grabber reportedly includes performance enhancements that collect and analyze large amounts of data in real-time and compensate for lighting variations. Imaging Technology Inc. (ITI), Bedford, Mass.
Video InspectionThe IC-BGA1 is the newest InspectaCam video inspection system. BGAs have sparked the marketplace demand for inspection tools that ensure proper placement on tiny solder balls. This system is a lightweight, hand-held inspection tool. The camera reportedly features LED illumination and a prism tip resulting in a choice of viewable angles. SMG Enterprises, Twain Harte, Calif.
PCBs/SUBSTRATES/LAMINATESInterconnect SolutionThis low-temperature cofired ceramic (LTCC) interconnect solution is said to provide full customization from ceramic-mix formulation, through track, via component and layout, to assembly of complete modules for use in the wireless, telecommunication and automotive industries. LTCC is a technique whereby up to 50 layers of ceramic tape are sandwiched together and fired to form a single multilayer rigid substrate. C-MAC MicroTechnology, Durham, N.C.
PCB Test BoardThe 0201 Test Board is the newest addition to this line of fine-pitch, multi-application solder-training boards and kits. This board is double-sided with 500 placements per side oriented in vertical and horizontal alignment. It features pads for the 0201, 0402, 0603 and SOT 323 components. The 0201 board and other PCB practice boards are available alone or as a complete kit with components. Practical Components, Los Alamitos, Calif.
CPU BoardThe Millennium S370 CPU board was designed using the Pentium II/Celeron and Pentium III processors. It reportedly features clock rates of 500 MHz and higher, a 66 MHz front-side bus (100 MHz bus optional) and a socket 370 host interface. The all-in-one motherboard's modular switching power supply complies with the Intel v4.8 specification. The board operates on supplies from 18 to 36 V across operating temperatures of 5° to 60°C. MicroDesign USA L.P., Clarksville, Tenn.
High-frequency LaminatesThe ComClad family is comprised of high-frequency laminates for semirigid or flexible circuits used in wireless communications. The material technology is designed for the microwave and RF segments of the wireless market, which includes base stations, satellite communications, PCB antennas, two-way pagers, direct broadcast antennas and antennas for various other applications. Sheldahl Inc., Northfield, Minn.
Flexible Circuit MaterialsThis line of flexible circuit materials reportedly supports the automated manufacturing of flexible circuits with fine patterns and high densities. These products include R/flex Crystal laminates, which are flame-retardant, wire-bondable and easy to process; R/flex 8080 LP, a liquid photoimageable covercoat; and R/flex 1000, a laminate that reportedly can withstand millions of flexes without failure. Rogers Corp., Rogers, Conn.
Programmable PCBThe PCI10K-PROD is a programmable PCB that reportedly enables users to quickly customize applications, eliminating the time spent on debugging and tweaking existing hardware to suit customized applications. Created for IT professionals and system developers, it is said to offer efficient integrated processes and high-speed data transfer. The units are designed with high-density I/O connectors to support custom daughtercards fitted with proprietary processes or applications. PLD Applications, Gardanne, France.
BoardsThe hard-to-find Multibus I, iSBX and Cimbus boards, including the SBC519A I/O board, SBC-86/05 single-board computer, and iSBX488 board with IEE488 bus and Direct Memory Access (DMA), are available with support. The boards reportedly are a form, fit and functional equivalent for these industry standards. While these building blocks may be based on older processor technology, generally they are said to be a more appropriate choice than newer, more expensive technology. Zendex Corp., Dublin, Calif.
LaminatesThe Pyralux AP laminate products for creating high-performance flexible circuitry reportedly use new technology to attach thin copper foils to thinner laminates without using adhesives, while retaining high bond strength. Available for fabrication of double-sided flexible laminates are Pyralux AP-7163 E (featuring 9 mm ED copper) and Pyralux AP-7164 E (featuring 12 mm ED copper), both with 25 mm Kapton polyimide dielectric. DuPont Flexible Circuit Materials, Wilmington, Del.
PICK-AND-PLACEPlacement SystemsThe Meridian 1050 Series consists of two placement systems: the 1050M and the 1050P. They are said to provide manufacturers with high-productivity IC and large-component placement. The former is designed specifically for memory-board production and achieves maximum placement rates as high as 8,000 CPH, while the latter is for high-speed placement of ICs and connectors up to 50 x 50 mm, including QFPs, BGAs and CSPs. Quad Systems Corp., Willow Grove, Pa.
Assembly CellThe HiSAC 500 Odd-Form Placement Cell is said to be a compact system that conserves floor space yet provides fully automatic placement of through-hole and SMT components. It reportedly is suitable for shield or connector placement for the mobile phone industry as well as those needing to place a small number of odd-form components with minimal impact on line length and limited system investment. The system, which is 59 x 69.6", is designed to be fast and flexible. Various feeders can be used with this product, from commercially available tape-and-reel feeders to special tube, tray or custom feeders. PMJ automec USA Inc., Grand Prairie, Texas.
Placement MachineThe Flexplacer is an upgradable SMT placement system designed to grow with production needs. The machine reportedly has direct-drive X- and Y-axis linear encoders to control head travel and 100 percent touchless combined laser/vision centering on all components. It also handles up to 128 x 8 mm tape feeders in widths up to 56 mm, or up to 16 vibratory feeders for sticks and waffle trays together with feeder carts for "on-the-fly" quick-batch changeover. When production requirements expand, field-upgradable MultiMode technology is said to enable the customer to upgrade the machine with a high-speed rotary head. MultiTroniks, Warren, N.J.
REPAIR/REWORKRework StationThe MBT 250-SDPT is a multifunction rework station. Its front-panel graphics reportedly make the unit easy to set up and operate. The SDPT acronym reflects the type of hand tools packed out with the system: Solder, Desolder, ThermoPik and ThermoTweez. For soldering, the PS-80 iron is said to be versatile. To handle desoldering tasks, the SX-80 Sodr-X-Tractor is a new desoldering handpiece with a disposable solder chamber. Pace Inc., Laurel, Md.
Photonic Soldering SystemThe LS-100 Photonic Soldering System is designed to rework straddle-mount connectors using photonic technology. This highly repeatable process is said to reduce the time required to move the connector from 40 to less than 5 minutes. It also can be used to solder a new straddle-mount connector onto the board. The product uses a Yttrium Aluminum Garnet (YAG) laser beam to desolder the top surface of the connector, and a convection-heat source to desolder the bottom surface as well as regulate thermal stress on the board to prevent warping. ViTechnology LLC, Haverhill, Mass.
Fume ExtractionThe stand-alone BVX-100 single arm/ plenum benchtop fume extractor is a completely self-contained unit with no external ducting or compressor requirements. It can be moved from one assembly or rework station to another, and after being plugged in and switched on, reportedly is ready for immediate use without needing to be reconfigured. The unit is designed to meet the demands of flexible manufacturing and create a more comfortable environment in which repair and rework operators can work. Metcal Systems, a Div. of OK International, Menlo Park, Calif.
Advanced Rework SystemThe Freedom 3000 is said to be suitable for removing and replacing BGA, CSP, flip chip and fine-pitch components, as well as process development and prototype production. The machine reportedly has user-friendly controls, a great range of site-prep options and an automated optics shuttle. It uses PLC-based control system and custom Windows-based software. Other enhancements include an auto-shuttle that eliminates the need for operator-controlled positioning of the optics train and zoned preheater capability. Conceptronic Inc., Portsmouth, N.H.
Rework SystemThe M-9100AV rework system calculates alignment, places the component and solders it, all while reportedly requiring no more operator involvement than a few clicks of the mouse. It requires minimal training, no calibration, and does not rely on the operator's eyesight or ability to visually align components; the system's software does the work. The software also is said to provide control over temperature, airflow and duration during the solder process. Manncorp, Huntingdon Valley, Pa.
Solder Removal SystemThe Manual Scavenger is a field-upgradable, non-contact solder removal system for the Summit 1000 and 1100 Series for rework and repair of BGA and microBGA boards. With this system, users reportedly can safely remove residual solder without contacting SMT boards, reducing the risk of damage to the board pads, traces and solder mask. It is said to require minimal setup. Sierra Research & Technology (SRT), a Div. of GenRad Inc., Westford, Mass.
STATIC CONTROL PRODUCTSESD ProtectionTwo new devices, the PAC DN1408C and PAC DN2408C, are ESD-protection products available in the CSP format. The solder bumps are said to allow attachment to laminate boards without using underfill. They are intended for use in applications where an extremely small footprint is required, especially cellular phones and PDAs, and for Internet appliances and PC ports where space savings might be desired. California Micro Devices Corp., Milpitas, Calif.
Static ControlThe Sole Grounder is said to increase the contact area of the foot with an ESD-control floor surface. It comes in three sizes to fit almost every user. Extra-wide bands of rubber reportedly provide greater contact area with the floor or mat. The dual-layer rubber has a fiberglass scrim inner layer to provide tear resistance and longer life. A combination of fasteners reportedly allows adjustment for most shoes. A white inner lining will not mark shoes, and a 0.25 W, 2 MW resistor is standard. Desco Charleswater, Chino, Calif.
Digital Static MeterThe Model 212 Digital Static Meter is a lightweight, precision static meter that features an LCD, recorder output jack and chopper-stabilized sensor for long-term measurements in both normal and ionized environments. The measurement range is from 0 to ±20 kV at a meter-to-object distance of 1". The 3.5-digit LCD meter provides 10 V resolution, polarity indication and low-battery warning. The meter uses LED-ranging lights for increased measurement accuracy. A locking push-button measure/hold switch enables the user to take a measurement and then hold the reading. Accessories are available. electro-tech systems inc., Glenside, Pa.
TEST EQUIPMENTAutomated Flying Probe TesterThe A4a is an automated flying probe tester. Said to be a high-speed, double-sided test system for complex bare-board evaluations, it reportedly offers throughput for flying probe applications. Its configuration, patented measurement method and automation features are designed for qualifying up to a row of boards in tandem. Operating up to 16 moving probe heads made of light materials and featuring two alignment cameras, this compact, low-profile machine is intended for middle-size capacity production lines. Everett Charles Technologies, Pomona, Calif.
Rackmount Test SystemsThe GR Powered series of rackmount test systems are available in a 19" rackmount chassis that allows resellers and systems integrators to integrate the test systems into the solutions they provide. The series includes the Stinger, TestStation, GR Viper, GR Versa and GPX621 test systems. GenRad Inc., Long Beach, Calif.
SoftwareThis update to the TestVue operating system for the PinPoint ICT is said to enhance the operator's ability to create new test programs using artificial intelligence and expert systems (AI/ES) embedded within software. Enhancements and new features reportedly include a new Program Studio software suite, PinPoint NetGen, enhanced "EZ" mode, registered Boolean programs and program portability. DiagnoSYS Systems Inc., Kissimmee, Fla.
Bond TesterSystem 580 high-precision bond tester reportedly delivers 100 ppm accuracy to meet the demands of fine-pitch bonding, tight process control and traceability. Step-and-repeat submicron servo-motor-driven X-Y stage is included. The optional digital-image capture of sheared bond site permits process comparisons between plants across the Internet. Royce Instruments Inc., Napa, Calif.