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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Change Your DAM Thinking: DAM Registration
In last month’s column, How Can You Predict Your Company’s DAM Future?, I discussed the bad behaviors that block progress in understanding PCB registration. Once data and discovery overtake people’s opinions and their need to be right, progress can be made. Today, PCB registration isn’t the problem it once was. However, we have left the understanding of registration in the hands of a few specialists. This is a mistake. Registration is fundamental to making a board. It is still a major contributor to scrap from internal shorts. It defines our level of technology capability and is part of any OEM’s future technology roadmap. If we don’t understand registration the way we need to, then we are blind to some powerful opportunities to improve our business operations.
Registration can be absolutely understood. There are three registration error modes: offset, scaling, and rotation. Let’s look at the offset errors first, since they are the easiest to understand.Read the full column here.
This column originally appeared in the February 2013 issue of The PCB Magazine.
More Columns from Solving DAM Problems
Solving DAM Problems: Solving a True DAM ProblemSolving Dam Problems: Why Removing Your Bottleneck is a Bad Idea
Change Your DAM Thinking: Do We Need to be More Innovative?
Solving DAM Problems: Can Scrap be Beaten? A Strategy for 2014 and Beyond
Solving Dam Problems: How to Compute Your Plant's DAM Capacity
Solving DAM Problems: Standards are DAM Important!
Solving DAM Problems: What's the DAM Problem with Scheduling?
Solving Your DAM Problems: Examine Your DAM WIP