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Micron Announces Leadership Appointments to Accelerate Innovation and Growth

08/28/2026 | Micron
Micron Technology, Inc. announced the promotion of two senior executives to newly expanded leadership roles designed to further strengthen the company's execution, innovation and long-term growth strategy.

NASA Awards Infleqtion $20M as World's First Quantum Gravity Mission Advances Toward Flight

08/27/2026 | BUSINESS WIRE
Infleqtion, a global leader in quantum computing and quantum sensing powered by neutral-atom technology, announced NASA has awarded the company a $20 million follow-on contract to continue development of the Quantum Gravity Gradiometer Pathfinder (QGGPf), a mission led by NASA’s Jet Propulsion Laboratory (JPL) that is designed to fly the world's first space-based quantum gravity sensor.

IBM Completes Acquisition of HRL Laboratories to Accelerate the Future of Quantum

08/26/2026 | IBM
IBM announced it has completed its acquisition of HRL Laboratories, LLC (HRL), a leading research and development institution whose expertise spans quantum computing, quantum sensing, advanced communications, electronics, manufacturing, and materials science.

Indium to Present Materials Solutions for the Next Wave of Power Electronics at CIPA 2026

08/26/2026 | Indium Corporation
Indium Corporation® Senior Area Technical Manager Leo Hu will examine the keys to precisely matching the diverse process requirements of power module packaging and assembly at CIPA 2026, August 31-September 2, in Wuxi, China.

VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.