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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Nine New Exciting Products Introduced
April 16, 2015 | Real Time with...IPCEstimated reading time: Less than a minute

At the IPC APEX EXPO 2015 Show held in San Diego, Calif., Insulectro's Ken Parent introduced us to nine new products including high-speed laminate, high-temp flex materials, LDI dry film, conformal back-up material for flex-rigid,and printed electronics materials that will enable new technology in the PCB world. Listen to him explain Insulectro's "Accomplish Change Together" program.
Watch the full interview here.
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