-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIntelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
An Optical Update with TTM
April 16, 2015 | Barry Matties, I-Connect007Estimated reading time: 6 minutes
Immonen: There are customers who are really looking at this for in a high-end routing, switching and in server infrastructure. That means high volumes. Obviously, supercomputing is an example of a very niche market. We want to see the potential in the high-volume markets.
Matties: When will you make this technology available in the marketplace?
Immonen: That probably will happen in a time frame of two to four years.
Matties: Why is it taking so long?
Immonen: Copper has made its way. We predicted that beyond 10 Gbps, it would be all optical, but we were wrong. We were predicting something around 16-18 Gbps, and now we're seeing 25 Gbps coming. But as the links will be shorter, the loss budget will be tighter, and the overall expense due to various chipsets needed to get clean the signals is significantly higher, customers are forced to look at other alternatives including optical.
Matties: In the world of technology, four years is an eternity. Is there something that could come and just bump this out of its place before you get it to market?
Immonen: Previously, the question was rolling around, optics vs. copper. Now it's more a question of which kind of optics will push the market first: multi-mode or single-mode, simple flex solutions or embedded optics, and at which wavelength, application or distance? We cannot put all of our fruit in one basket, so we are also developing a variety of options, including those that support the emerging silicon photonics technology which has made significant breakthroughs in recent years and has a lot of expectations.
Matties: Is this something you're going to license to others, or is this going to be an exclusive process for TTM?
Immonen: This is one option, definitely, licensing technology to others.
Matties: Well, thanks for sharing this story with us and I look forward to future updates.
Immonen: Thank you very much.
Related Presentation: Development of Optical Interconnect PCBs for High Speed Electronic Systems - Fabricator's View
RELATED VIDEO
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.