Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Indium Experts Investigate PCB Performance and Connectivity Solutions at SMTAI 2026

10/26/2026 | Indium Corporation
Five tech experts from Indium Corporation, a leading developer of AI-enabling and high-reliability soldering materials, will share new technical insights at SMTA International 2026, October 25–29, in Rosemont, Illinois.

Indium Highlights Advanced Solder Solutions for Electronics Manufacturing at EFX 2026

09/29/2026 | Indium Corporation
As an industry leader in innovative materials solutions for electronics packaging, Indium Corporation® will showcase its high-reliability solder pastes for PCB assembly and automotive applications at Expo for Electronics Manufacturing (EFX) 2026, October 6-8, in Stuttgart, Germany.

Indium Experts to Present Advanced Packaging, AI, and High-Performance Computing Materials Solutions at IMAPS Symposium

09/28/2026 | Indium Corporation
As a leading provider of high-reliability, AI-enabling soldering materials, three Indium Corporation experts will share new research and insights on addressing advanced packaging and high-power performance challenges at the IMAPS Symposium 2026, September 29-October 1, in Boston, Massachusetts.

Indium Promotes Hongwen Zhang to Research and Development Director

09/04/2026 | Indium Corporation
Indium Corporation has promoted Hongwen Zhang, Ph.D., to Research and Development (R&D) Director. In this role, he will lead technology development, product road-mapping, and the continued advancement of the company’s materials portfolio.

Battalion Advanced Technology, Penn State Launch National Security Research Collaboration

09/02/2026 | PRNewswire
Penn State and Battalion Advanced Technology Ltd, have entered into two research agreements worth up to $6 million to develop advanced semiconductor platforms and high temperature materials that aim to enable next generation energy, transportation, aerospace and industrial systems while also providing critical capabilities for national security.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in