Dan’s Biz Bookshelf: ‘The Next RenAIssance: AI and the Expansion of Human Potential’
The Chemical Connection: When the Industry Moves Faster Than the Standards
Driving Innovation: Selecting the Right Laser Source
Amphenol Invotec Gains UL Approval for I-Tera MT
June 29, 2015 | Amphenol InvotecEstimated reading time: Less than a minute
Amphenol Invotec Ltd has gained approval from Underwriters Laboratories for I-Tera MT, a very low-loss laminate developed for high-speed applications.
I-Tera MT laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.
Featuring a dielectric constant (Dk) that is stable between -55°C and +125°C up to 20 GHz, they are suitable for many of today’s high speed digital and RF/microwave printed circuit designs.
They also offer a lower dissipation factor (Df) of 0.0035, making them a cost-effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials.
Amphenol Invotec have already successfully used I-Tera MT on a number of customer sequential lamination and stacked microvia designs, including LDI solder mask defined micro BGAs.
For further details on this and other materials within our material portfolio, please contact your sales representative or visit www.amphenol-invotec.com.
Share on:
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.
KYZEN Focuses on Aqueous and Stencil Cleaning Solutions at SMTA Monterrey Expo and Tech Forum
04/10/2026 | KYZEN'KYZEN, the global leader in innovative environmentally friendly cleaning chemistries, will exhibit at the SMTA Monterrey Expo & Tech Forum.
Solder Paste Innovations for Enhanced Reliability from MacDermid Alpha Electronics Solutions
04/10/2026 | Real Time with... APEX EXPOJason Fullerton of MacDermid Alpha Electronics Solutions discusses innovative alloys like Innolot MXE, low-temperature solder options, and polymer reinforcement strategies. Learn how these solutions address the growing demands of high-performance computing and larger component assemblies, ensuring optimal performance and cost-effectiveness.