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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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Amphenol Invotec Gains UL Approval for I-Tera MT
June 29, 2015 | Amphenol InvotecEstimated reading time: Less than a minute
Amphenol Invotec Ltd has gained approval from Underwriters Laboratories for I-Tera MT, a very low-loss laminate developed for high-speed applications.
I-Tera MT laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.
Featuring a dielectric constant (Dk) that is stable between -55°C and +125°C up to 20 GHz, they are suitable for many of today’s high speed digital and RF/microwave printed circuit designs.
They also offer a lower dissipation factor (Df) of 0.0035, making them a cost-effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials.
Amphenol Invotec have already successfully used I-Tera MT on a number of customer sequential lamination and stacked microvia designs, including LDI solder mask defined micro BGAs.
For further details on this and other materials within our material portfolio, please contact your sales representative or visit www.amphenol-invotec.com.
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