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Real Time with... SMTA Guadalajara 2024: From Taiwan to Mexico: TRI's Expansion

09/26/2024 | Real Time with... SMTA Guadalajara
Speaking with Nolan Johnson is Fernando Salomon, sales manager for Test Research, Inc., discussing TRI's increasing presence in Mexico, particularly in Guadalajara. Salomon explains that TRI recognizes the importance of the Mexican market and has invested in local offices and staff.

ASC Sunstone Circuits to Present Lunch and Learn and Exhibit at PCB West 2024

09/24/2024 | ASC Sunstone
ASC Sunstone Circuits will be exhibiting at PCB West 2024 Conference and Exhibition to be held from October 8th through the 11th at the Santa Clara Convention Center in Santa Clara, California.

All Flex Solutions Certified to ANSI/ESD S20.20-2021

09/19/2024 | All Flex Solutions
Factories that handle ESD-sensitive components at All Flex Solutions have earned certification to ANSI/ESD S20.20-2021 Electrostatic Discharge Control Program.

Augering in on Dispensing

09/19/2024 | Nolan Johnson, PCB007
In this interview with Sunny Agarwal, a senior applications and process engineer at Camalot Dispensers R&D, we talk about the choice between traditional methods and jet dispensing. Sunny says it depends on material properties, especially viscosity. Dispensing is very specific to application requirements, and excels in scenarios involving tall components, where precise droplet placement is crucial.

IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

09/16/2024 | IPC
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
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