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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
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I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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TTM: Consult Fabricators Early for PCB Designs
July 2, 2015 | Andy Shaughnessy, PCBDesign007Estimated reading time: 6 minutes
Shaughnessy: It looks like something that would make a fabricator say, "Are you serious?"
Ellis: The industry has changed tremendously since I started in it, that's for sure. I used to wire wrap assemblies when I was a kid.
Shaughnessy: In your talk, you mentioned how everyone talks about drilling vias below six mils. But then you point out that six mils is only two times the width of a human hair.
Ellis: Yes. I feel like I’m always splitting hairs when I build fine-pitch stack-ups, because they require trade-off analysis between minimum aspect ratio, hole sizes, pad and antipad sizes, the space left between those pads, and how many traces can be run between the pads, if any. 6 mils is the smallest mechanical drill size we’ll use in North America, and it’s only the diameter of 2 human hairs and smaller than a hypodermic needle. Because 6 mil drill bits break easily, can’t be re-sharpened, and are very expensive, Asia sites rarely use them. So I never design a stack-up for our China sites using a 6 mil drill. But as hole size increases, so do the pad diameters in order to maintain annular ring requirements, and that can kill the routing space between pads.
Come to think of it, another thing I would like to see engineers do more often is consider the production site technical capabilities. Offshore PCBs are significantly lower in cost, because they’re optimized for continuous processes that don’t need to be interrupted or require highly advanced, but slow, equipment or processes. Asia sites have excellent capabilities, but they are not all at extreme tech levels of some of our N. America sites. So designs should be done in accordance with production site guidelines and available materials.
Shaughnessy: Sure. Well, it was a great talk. You covered a lot of really cool cutting-edge stuff. The designers in the crowd really enjoyed it.
Ellis: Thank you.
Shaughnessy: Thank you, Julie. I appreciate your time.
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Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.