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Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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EIPC Now Accepting Orders for T-50 Revision M Report
July 6, 2015 | EIPCEstimated reading time: Less than a minute
Each year, a new slew of terms and definitions become commonplace in the manufacturing process. IPC's report T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board technology.
EIPC is now accepting orders for the hard copy of the report. For more information, email eipc@eipc.org.
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Zollner Leverages electronica 2024 to Strengthen Global Partnerships
11/27/2024 | Zollner Elektronik AGZollner, a leading provider of electronic manufacturing services (EMS), successfully participated in electronica 2024, one of the world's largest trade fairs for electronics.
Happy Thanksgiving From the I-Connect007 Team
11/27/2024 | Andy Shaughnessy, I-Connect007As we take time to observe Thanksgiving, the I-Connect007 team wishes to offer our thanks to our readers and contributors: designers, fabricators, engineers, assemblers, quality and process control gurus, chemists, physicists, supervisors, managers, entrepreneurs, business owners, standards writers, industry experts, and more. Thank you all for your support.
VDMA Machine Vision Elects New Board; Appoints Olaf Munkelt as Chairman
11/26/2024 | VDMAWithin the context of the members' assembly of the VDMA Robotics + Automation Association, the members of the VDMA Machine Vision division elected a new Board. Olaf Munkelt, Co-founder and Managing Director of MVTec Software GmbH, was subsequently appointed Chairman by the newly elected VDMA Machine Vision Board.
Subdued Electronics Industry Sentiment Continues in November
11/25/2024 | IPCIPC releases November 2024 Global Sentiment of the Electronics Manufacturing Supply Chain report
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/22/2024 | Andy Shaughnessy, I-Connect007In this week’s roundup, I’m highlighting a variety of articles. We have an interview with Jess Hollenbaugh, a recent graduate working for Polar Instruments. We also have an interview with IPC’s Matt Kelly and Devan Iyer, whose white paper may provide a way forward for companies dealing with complex advanced packages. Our newest columnist Tom Yang describes the U.S. PCB industry from the point of view of a technologist from another country, and Dan Beaulieu has a review of Malcolm Gladwell’s follow-up to The Tipping Point. Finally, we have my review of PCB Carolina, a one-day tabletop show that keeps expanding, much like my waistline after eating their catered food. Enjoy!