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In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
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EIPC Now Accepting Orders for T-50 Revision M Report
July 6, 2015 | EIPCEstimated reading time: Less than a minute
Each year, a new slew of terms and definitions become commonplace in the manufacturing process. IPC's report T-50 Revision M, Terms and Definitions for Interconnecting and Packaging Electronic Circuits, delivers users the most up-to-date descriptions and illustrations of electronic interconnect industry terminology. It is a dynamic standard that adapts to the industry to provide the most thorough dictionary in the industry.
This essential industry standard provides descriptions and illustrations of electronic interconnect industry terminology to help users and their customers break down language barriers. Revision M contains over 220 new or revised terms, including new terminology for conformal coatings, potting and encapsulation processes, stencil design, statistical process control, and flexible printed board technology.
EIPC is now accepting orders for the hard copy of the report. For more information, email eipc@eipc.org.
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
09/27/2024 | Nolan Johnson, I-Connect007If you know Dave Hoover of TTM, then I am honored to inform you that he has retired from the industry as of this week. But we can keep tabs on him through his weekly online blues radio program “Groovy Hoovy’s Different Shades of Blue Radio and Video Show.” Congratulations on your transition to “civilian” life, Dave.
Nano Dimension to Acquire Markforged, Leading AM Player
09/26/2024 | Nano DimensionNano Dimension Ltd. and Markforged Holding Corporation jointly announced that they have entered into a definitive agreement pursuant to which Nano Dimension will acquire all outstanding shares of Markforged in an all-cash transaction for $5.00 per share.
Eaton, SIAEC Announce Key Milestones for Joint Venture
09/25/2024 | BUSINESS WIREIntelligent power management company Eaton and SIA Engineering Company Limited (SIAEC) unveiled the logo for their joint venture, Eaton Aerospace Component Services Asia Sdn. Bhd. (EAS), at MRO Asia-Pacific.
World Robotics 2024: Asia’s Boom Fuels 4 Million Robots in Global Factories
09/24/2024 | IFRThe new World Robotics report recorded 4,281,585 units operating in factories worldwide - an increase of 10%. Annual installations exceeded half a million units for the third consecutive year. By region, 70% of all newly deployed robots 2023 were installed in Asia, 17% in Europe and 10% in the Americas.
ROCKA Solutions to Make Its First SMTA International Debut with Innovative Exhibit Style
09/24/2024 | ROCKA SolutionsROCKA Solutions is excited to announce its first-time participating in SMTA International 2024, taking place at the Donald E. Stephens Convention Center. Visit ROCKA Solutions at Booth 2947, where they will introduce a fresh exhibit style to the USA tradeshows.