-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Multitest’s MT9510 Offers New Contact Site Layouts
July 8, 2015 | MultitestEstimated reading time: 2 minutes
Multitest’s well-established MT9510 tri-temp pick and place handler is now available with various site pitch layouts, which are compatible with major standard handlers in the market. The new site pitch layouts enable to customer to re-use existing loadboards from other handling equipment for applications on the MT9510.
The Multitest MT9510 is a kitable tri-temp pick and place handler, which is known for its superior temperature performance and a wide range of options to address specific customer requirements. With an installed base of more than 800 the MT9510 platform is highly accepted in Asia, Europe and USA. The site pitch compatibility now allows for easy and economic transfer of applications form other handling equipment to this highly reliable system by reusing the existing test interface boards.
The MT9510 platform supports parallel test of up to 8 devices (MT9510 XP) or up to 16 devices (MT9510 x16) with up to 4 (MT9510 XP) or 8 (MT9510 x16) horizontal sites. The new site pitch layout for quad setups allows for horizontal site pitches from 40mm up to 80 mm and vertical site pitches from 60 mm up to 63.5 mm. The new site pitch layouts require only a minor modification of the handler base and therefore are backward compatible to a standard MT9510 site pitch.
Syariffuddin A.Kamarudin, Product Manager for the MT9510 platfrom adds: “The new site pitch layout option not only allows an easy transfer of standard applications from other pick and place handler brands, but also make the MT9510 compatible for the Multitest MEMS modules, which have been developed for the Multitest gravity feed product line. Beyond the direct reuse of existing test interface boards, we see our customer leveraging the loadboard compatibility at their engineering sites, where they now can use the exact same board design for package characterization, as it will be used later in volume production”
To learn more please visit www.multitest.com/MT9510
About Multitest
Multitest (headquartered in Rosenheim, Germany) is one of the world’s leading manufacturers of semiconductor material handling equipment and interfaces for the testing and calibration of semiconductors and sensors. Multitest markets a broad portfolio of innovative and performance driven test handlers, contactors and ATE printed circuit boards. Multitest has more than 30 years of experience in the semiconductor industry, providing solutions to the automotive, consumer, communication, and sensor markets. Multitest is a company of Xcerra™ Corporation, which provides capital equipment, interface products, and services to the semiconductor, industrial, and electronics manufacturing industries. Xcerra Corporation offers a comprehensive portfolio of solutions and technologies, and a global network of strategically deployed applications and support resources. Additional information can be found at www.multitest.com and www.Xcerra.com
Suggested Items
Skunk Works Demonstrates Airborne Battle Management of AI-Controlled Aircraft
11/27/2024 | Lockheed MartinLockheed Martin Skunk Works, in partnership with Lockheed Martin's Demonstrations and Prototypes organization and the University of Iowa's Operator Performance Laboratory (OPL), showcased a crewed-uncrewed teaming mission where an airborne battle manager issued real-time commands to AI-controlled aircraft through a touchscreen pilot vehicle interface (PVI).
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
Real Time with... electronica 2024: SPEA's AI Integration—Innovations in Test Equipment
11/25/2024 | Real Time with... electronicaIn this interview from electronica 2024, Pete Starkey speaks with Andrea Furnari, VP of Electronic Test Products Business Unit for SPEA. The discussion revolves around AI integration in test equipment, trends in substrate materials, and SPEA's focus on R&D.
Winners of IPC Hand Soldering World Championship at electronica 2024 Announced
11/21/2024 | IPCIPC hosted its Hand Soldering World Championship in Munich, Germany, at electronica on 14-15 November 2024, welcoming 14 competitors from 13 companies and 12 countries worldwide. Skilled contestants competed to build an electronics assembly in accordance with IPC-A-610 Class 3 criteria, and were judged on the functionality of the assembly, compliance with the assembly process and overall product quality. The contestants were allowed a maximum of 60 minutes to complete the assembly.
Indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities
11/20/2024 | indie Semiconductorindie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.