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Suggested Items

I-Connect007 Welcomes Newest Columnist, Tianming Liu, FSQuality

08/27/2026 | I-Connect007
I-Connect007 is excited to announce its newest columnist, Tianming Liu, founder of First Quality Circuit Co. Ltd. (FSQuality) and Fuji PCB. His new column, Bridging the Pacific, will draw on more than three decades of experience in PCB manufacturing to explore the different manufacturing cultures, practices, and perspectives found across the global electronics industry.

Standard of Excellence: ‘Quality’ Is Your Company's Greatest Competitive Advantage

08/26/2026 | Anaya Vardya -- Column: Standard of Excellence
Quality has often been viewed as the final checkpoint before a product is shipped to a customer. Manufacturing organizations invest heavily in inspection teams whose responsibility is to identify defects before they escape into the marketplace. While that approach has served our industry reasonably well for many years, today's manufacturing environment demands something fundamentally different.

It’s Only Common Sense: Customers Need Confidence More Than Low Prices

08/24/2026 | Dan Beaulieu -- Column: It's Only Common Sense
It’s a business myth that customers buy primarily on price. This belief has shaped sales strategies for decades, but after more than 40 years working with electronics manufacturers, OEMs, and EMS providers around the world, I have learned this simply is not true. Customers are actually looking for the lowest risk. From AI to advanced manufacturing technologies, we are producing products that would have seemed impossible only a few years ago. Every new product carries enormous expectations, and every supplier becomes an important part of that customer's success. In an environment like this, confidence has become one of the most valuable products any company can offer.

Global Sourcing Spotlight: Global Sourcing in the Age of Constant Uncertainty     

08/19/2026 | Bob Duke -- Column: Global Sourcing Spotlight
Global sourcing has been built on finding the lowest possible cost. Companies have spent years refining supplier networks, negotiating pricing, consolidating purchasing power, and driving efficiency throughout the supply chain. This strategy has worked well in a relatively stable world where disruptions were the exception rather than the rule.

Advanced Electronic Packaging: The Industry's New Innovation Engine

08/13/2026 | Marcy LaRont, I-Connect007
Over the past several years, advanced packaging has moved from the back end of semiconductor manufacturing to becoming one of the electronics industry's most strategic technologies in the ecosystem. At many IEEE conferences, discussions that once centered almost exclusively on transistor scaling now devote equal attention to chiplets, heterogeneous integration, co-design, advanced substrates, thermal management, and system-level packaging.
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