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EIPC is pleased to advise that we have two new companies who have joined us in the last few days.
They are:
1. Technolam, Froisdorf, Germany
Contact person: Mr. Günther Fuchs and Mr. Andreas Folge
Phone: +49‐2241‐8737‐0
Website: www.technolam.de
2. HDP User Group International Inc., Cave Creek, USA
Contact person: Mr. Marshall Andrews and Mr. Larry Marcanti
Phone: +1‐512‐258‐0332
Website: www.hdpug.org
High Density Packaging (HDP) User Group is a global research and development organization based in Cave Creek Arizona, USA dedicated to “reducing the costs and risks for the Electronics Manufacturing industry when using advanced electronic packaging and assembly”. This international industry led group organizes and conducts R&D programs to address the technical issues facing the industry, including design, printed circuit board manufacturing, electronics assembly, and environmental compliance. Membership is open to all companies throughout the world who use, supply, or support electronics manufacturing.
Collaborative leverage is one of the keys to HDP User Group’s success. Our projects provide extraordinary cost savings for our membership by employing shared resources directed at key issues or new technologies our membership wishes to address.
HDP User Group has been a project oriented industry consortium for over 20 years. In addressing the integration of new electronics component packaging and interconnect technologies into company supply chains, it continues to provide value to all its 51 member companies.
HDP User Group maintains additional offices in Austin, Texas, The UK, and Singapore.
