-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Meet the Author: Beth Turner Explores Encapsulating Sustainability for Electronics
July 28, 2025 | I-Connect007Estimated reading time: Less than a minute

In a special Meet the Author edition of On the Line with…, host Nolan Johnson welcomes Beth Turner, senior technical manager at MacDermid Alpha Electronics Solutions. Beth is the author of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics.
In this insightful conversation, Beth dives into the world of encapsulation materials— covering the most widely used types, when and why they are applied, and how their evolution is being shaped by both performance demands and sustainability goals. She highlights this particularly exciting time for innovation in encapsulation, where cutting-edge functionality meets environmentally conscious design.
Whether you’re specifying materials or applying them on the manufacturing floor, Beth’s book is an essential guide for understanding today’s encapsulation strategies.
Explore Beth’s book: The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics.
Stay tuned for more episodes of On the Line with…, where industry leaders share behind-the-scenes insights into the technologies and trends shaping the future of electronics.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
BOOK EXCERPT: The Printed Circuit Assembler's Guide to... Encapsulating Sustainability for Electronics, Chapter 4
12/31/2024 | I-Connect007Bio-based encapsulation resins have the potential to contribute to sustainability targets by extending product lifetime and improving performance. The author explores the use of recycled materials such as biogenic waste and lightweight expandable polymers to create more efficient and environmentally friendly encapsulation resins.
BOOK EXCERPT: The Printed Circuit Assembler’s Guide to... Encapsulating Sustainability for Electronics, Chapter 3
07/24/2024 | I-Connect007 Editorial TeamThis chapter provides an in-depth analysis of general-purpose and specialist encapsulation resins for electronic applications. Also covered are properties, testing methods, suitability for harsh environments, and thermal management of high-power density electronic devices.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Encapsulating Sustainability for Electronics
06/12/2024 | I-Connect007 Editorial TeamEncapsulation resins are ruggedizing solutions for challenging environments. There are several different options available, and it is possible to segment them in many ways, including chemistry type, cure method, or end application. This book is written as an introductory guide to aid the reader in understanding these encapsulation resins. It should act as a tool for application troubleshooting, taking an in-depth look at specific test methods and their relevance to key industries. What follows is an excerpt from Chapter 1.
MacDermid Alpha Electronics Solutions’ New Book Now Available for Download
03/29/2024 | I-Connect007I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics by Beth Turner at MAES. The latest in a series of educational books published by I-Connect007, this book is an introductory guide to understanding encapsulation resins and a tool for application troubleshooting.
Heraeus Electronics, Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology
05/24/2023 | Heraeus ElectronicsHeraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement at the PCIM Europe exhibition in Nuremberg, Germany.