Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
AT&S China Committed to Corporate Social Responsibility
July 16, 2015 | AT&SEstimated reading time: 1 minute
AT&S, one of the global leading manufacturers of high-end HDI printed circuit boards (PCBs), has established a variety of Corporate Social Responsibility (CSR) activities in China. The company actively contributes to the society and strives to be an outstanding corporate citizen.
On 5 July 2015, volunteers of AT&S Chongqing visited Changxin Elementary School, where is located in Tongnan country of Chongqing city – one of the poorest areas in the southwest of China, provided supports on life and educational supplies. The hand-over ceremony was witnessed by all students, AT&S volunteers and officials from Tongnan country.
“The children were encouraged when we paid a visit on them. They were all happy about our greetings. This goes to show that sometimes it only takes little things to make others smile and brighten up their everyday life,” said Chen Jiang Phua, AT&S CEO BU Mobile Devices & Substrates. “We are proud of our dedication to responsible corporate citizenship.”
According to Mr. Phua, employee volunteering service and knowledge-related promotion of school classes is a central element of the company’s responsibility in China.
Through the site in Chongqing, the company in cooperation with the authorities has had opportunity to actively design contests to raise environmental awareness since 2014. The Shanghai site also shows its commitment to supporting youth education and “we care about people”. AT&S Cup was first launched in Shanghai in 2006. By joining hands with Shanghai Environmental Protection Bureau, the event has played a key role in nurturing the children’s life-long interest in environmental related topics. In 2015, AT&S Cup – Shanghai Youth Bilingual Presentation Contest kicked off in July. The final session and award ceremony is scheduled in November 2015. Besides, employees of the Shanghai site periodically visited senior citizen’s home in Zhuanqiao, Xinzhuang Industrial Park. The people always spent fun time with volunteers in chatting, photographing or a specially prepared singing and dance performance.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.