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Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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IPC Flex Circuits, HDI Conference Highlights Reliability
July 21, 2015 | IPCEstimated reading time: Less than a minute

The IPC Flex Circuits – HDI Conference, to be held from October 28 to 30 in Minneapolis, will focus on critical issues in high reliability electronics for the following market sectors: military-aerospace, medical, and automotive.
The event will feature senior technologists providing tutorials to cross-train experienced staff and managers; presentations of practical applications and new developments; and speeches on broad perspective on technical issues.
For more information, click here.
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