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Meeting High-Speed Demand with Optical Circuits
July 28, 2015 | Barry Matties, I-Connect007Estimated reading time: 7 minutes
Matties: Is the cycle time for manufacturing comparable to traditional circuit boards—quick-turn or whatever people need?
Betschon: Yes. The longest thing is usually the design process, until you have defined it together with the customer. Then it's more or less the same. It does not add additional time. Therefore, it's not really an issue on cost.
Matties: How many customers do you have that have been using this in a robust fashion?
Betschon: We are in the prototyping phase with multiple customers. On the other hand, three customers in the sensor field use our technology in their products. That's already very good for a small company like we have here.
Matties: And how many people are in your organization?
Betschon: We are currently a team of six highly skilled people. When it comes to electro-optical circuit boards, we usually work together with our mother company, Varioprint. Our staff focuses on the manufacturing of the optical layers and the coordination of the processing performed within Varioprint's premises.
Matties: If another manufacturer is reading this, and they are interested in using this technology, should they contact you and talk about the processing, licensing and so on?
Betschon: Definitely, if that's something that they're open to.
Matties: I understand that you are currently doing all of this in Switzerland. Do you have plans to set factories elsewhere, like China, for example?
Betschon: Not at the moment, no.
Matties: Felix, thanks so much and best of luck going forward with this.
Betschon: Okay, thank you for your interest.
Page 2 of 2Suggested Items
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Keysight Enabling University of Stuttgart to Advance 6G Integrated Circuits Research
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KSG Group Puts Horizontal OSP Line for Organic Surfaces into Operation
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Mil/Aero Design: Not Just Another High-Rel Board
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MACOM Awarded U.S. Air Force Contract for Advanced Semiconductor Development
07/20/2023 | Business WireMACOM Technology Solutions Inc., a leading supplier of semiconductor products, announced that it has been awarded a contract from the United States Air Force Research Laboratory (“AFRL”) to develop advanced semiconductor process technology related to Gallium Nitride-on-Silicon Carbide (“GaN-on-SiC”).