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SMTA Webtorial to Discuss Solder Paste Printing, Inspection
July 31, 2015 | Stephen Las Marias, I-Connect007Estimated reading time: Less than a minute
The Surface Mount Technology Association (SMTA) will be holding a two-part webtorial that will discuss solder paste printing and inspection. The webtorials, scheduled for August 11 and August 18 at 1:00pm to 2:30pm (Eastern), will be presented by Chrys Shea of Shea Engineering Services.
The webtorial combines the basics of SMT solder paste stencil printing and process troubleshooting with an overview of automated Solder Paste Inspection (SPI) technologies in both laboratory and production environments.
Process basics including material properties, process steps and the mechanics of proper printer setups, as well as process troubleshooting will help attendees identify potential root causes of print quality problems and diagnose them.
The SPI overview, meanwhile, will discuss the three major types of SPI measurement technologies and the similarities and differences in their measurement algorithms. The webtorial will also demonstrate how SPI is used in stencil printing research and development studies.
For more information, click here.
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