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Alpha to Present Technical Paper at China South Technical Conference
August 6, 2015 | AlphaEstimated reading time: 2 minutes
Alpha, the world leader in the production of electronic soldering and bonding materials, will present a technical paper at the upcoming SMTA South China Technical Conference on August 26th in Shenzhen, China.
The paper, titled “The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance” will be presented by Andy Yuen, Technical Services Director – Alpha Southern China and focuses on the effect of reflow profile on the electrical reliability of no-clean solder paste residue. This topic is of high interest within the electronics assembly community, as understanding how SIR results fluctuate based on reflow profiles can increase the long-term reliability of a solder paste.
SMTA China South Technical Conference
Date/Time: Wednesday, August 26, 2015 / 2:55pm – 3:30pm
Venue: Room 314, 3/F, Shenzhen Convention & Exhibition Centre, Shenzhen, China
Topic: The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance
Presented by: Andy Yuen, Technical Services Director of Alpha
To learn more about Alpha’s vast offering and capabilities, please visit our site at alpha.alent.com.
Speaker Biography
Andy Yuen is the Technical Services Director of Alpha Southern China. Andy joined Alpha in 1978 and has held technical support responsibilities in the Asia-Pacific Region for more than 30 years. He is a frequent speaker on soldering materials, especially related to Surface Mount Assembly Technology and Reflow/Wave Lead Free Soldering. Andy is a graduate of Queen’s University at Kingston, Ontario, Canada and holds a Bachelor Degree in Chemical Engineering. He is a member of SMTA, IMAPS and ACS.
About Alpha
Alpha, a business unit of Alent plc, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Americas, Europe and Asia Pacific regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™, Maxrel™, and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, liquid fluxes, solder pastes, cored wire, conductive adhesives and preforms for use in used in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, visit www.alpha.alent.com.
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