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AIM’s Flopy Feng to Present “Conformal Coating Over No Clean, Part 2” Paper at SMTA China South Technical Conference
August 7, 2015 | AIM SolderEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, announces that Flopy Feng, Technical Support Manager of south China, will present the second installment of the “Conformal Coating Over No Clean” paper by Karl Seelig, Vice President of Technology and Timothy O’Neill, Technical Marketing Manager, at SMTA China South Technical Conference. The conference will take place the 25th and 26th of August, 2015 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.
The need to increase package density and reduce costs, has led to the rapid deployment of leadless packages such as QFN, POP, LGA, and Micro-BGA. In many cases, the manufacturers of these devices will mandate the use of no clean fluxes, due to concerns over the ability to consistently remove flux residues from under and around these low stand-off devices. These concerns, have led to the challenge of applying conformal coating over no clean residues. In this study, AIM’s Research & Development Department paired with electronics manufacturers and conformal coating manufacturers in an attempt to characterize the different coating technologies currently available.
On August 26th, 2015, in room 314 from 3:30pm to 4:05pm (15:30 – 16:05), Mr. Feng will discuss the various coating materials that were tested with different chemistries of no clean fluxes, revealing possible combinations meeting the mission profile of the assembly with consideration for the assemblers’ capabilities and cost objectives.
For more information about conformal coating over no clean, please visit www.aimsolder.com or email info@aimsolder.com.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.
For more information about AIM, visit www.aimsolder.com
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