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U.S. Circuit Installs Direct Metallization Plating Line from Chemcut
August 12, 2015 | U.S. Circuit Inc.Estimated reading time: 1 minute
U.S. Circuit, Inc. has purchased and installed a state-of-the-art direct metallization plating line manufactured in the USA by Chemcut. This new line, in addition to our existing vertical metallization plating line, puts U. S. Circuit at the leading edge of direct metallization plating.
Designed and built by Chemcut to meet all of OMGI’s process requirements, the new line is a process-specific, horizontal conveyorized piece of equipment which has been designed to enhance the consistency of the process. The results have given U.S. Circuit a state-of-the-art horizontal direct metallization line.
Mike Fariba, U.S. Circuit's president, says, "We are dedicated to making improvements that are both beneficial to our customer’s products and to the environment. U.S. Circuit, Inc. has UL approval for this process which gives a superior base for through-hole plating. This process, manufactured by the OM Group, has been successfully delivering a quality product for the past 20 years. We have completed in-house testing as well as independent testing of a complete group B, Thermal Stress and Thermal Shock test at Preferred Labs, a military approved laboratory, using 12-layer and 14-layer boards. Test results, cross-sections and photos are on file for examination upon request."
To learn more about U.S. Circuit's capabilities, visit them online at: uscircuit.com/technology
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