Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
AIM to Participate in SMTA International
August 13, 2015 | AIM SolderEstimated reading time: 1 minute
AIM Solder will highlight their new M8 No Clean Solder Paste along with their full line of solder assembly materials at the SMTA International 2015 trade show, scheduled to take place on September 27th – October 1st, 2015 at the Donald Stephens Convention Center in Rosemont, Illinois. AIM will be located in booth 413.
An evolution of the highly successful NC258 platform, M8 is designed for the most demanding high-density electronic assemblies. Developed in combination with T4 and finer mesh tin/lead and lead-free alloy powders, M8 provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduces voiding on QFN/BTC components while producing bright shiny solder joints, leaving minimal, high purity residues engineered to be safely left in place.
Additionally, AIM’s Technical Marketing Manager, Timothy O’Neill and Research and Development Manager, Mehran Maalekian Ph.D., will be presenting at SMTA International’s technical conference. O’Neill’s presentation, Evolution of the Performance and Reliability Requirements of Soldering Fluxes, explores the constant evolution of flux chemistries due to the miniaturization and proliferation of electronics. In Maalekian’s presentation, The Effect of Bi Content on Properties of Low Silver SAC Solders, thermal behavior (melting and solidification), wetting and spreading performance, as well as tensile and hardness properties of various alloys are compared and a promising lead-free solder alloy is recommended.
To discover all of AIM’s products and services, visit the company in booth number 413 at SMTA International or at www.aimsolder.com.
About AIM
Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.
For more information about AIM, visit www.aimsolder.com
Share on:
Suggested Items
KYZEN to Highlight Understencil and PCB Cleaners at SMTA Querétaro Expo and Tech Forum
07/09/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 24, at Centro de Congresos y Teatro Metropolitano de Querétaro.
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.