Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
Nolan's Notes: The Next Killer App in Component Manufacturing
Essemtec to Exhibit Flexible SMT Production Equipment at SMTAI
August 24, 2015 | EssemtecEstimated reading time: 1 minute
Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, today announced that it will exhibit in Booth #335 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate the Parquda G2 multifunctional center and Cubus storage system.
3-in-1 Multifunctional Center
Paraquda G2 is the world’s first machine that combines three different processes within one platform (jetting of solder paste, jetting of glue and placing of SMD components). The multifunctional center meets all of the requirements of a modern, highly flexible production system – quick changeover, intuitive operation and the combined usage of jet and/or needle valves. With this unique combination, the Paraquda G2 allows an unprecedented flexibility in the market. Being able to complete various processes with one machine eliminates the need of separate machines and reduces the investment costs dramatically. Set up is done directly from imported CAD data using an integrated medium library.
Next-Generation SMT Storage System
Cubus innovates how SMT components are stored and provisioned for electronic manufacturing. For the first time, a storage device is fully user configurable and hence adapts to the dynamic manufacturing needs. There are no limitations in terms of reel sizes, reel widths or JEDEC trays. With its flexible shelf configuration, foolproof operation and easy line integration, it easily adapts to the ever-changing manufacturing environments. Thanks to its small footprint and high storage capacity (up to 932 reels), Cubus can be positioned close to any SMT manufacturing line. Cubus interfaces easily with pick-and-place machines and, thus, greatly reduces kitting time and errors as well as machine interruptions due to missing or misplaced material. Configure – Operate – Integrate!
For more information about Essemtec, visit www.essemtec.com.
About Essemtec AG
Essemtec AG is a privately held Swiss equipment manufacturer, specializing in high speed fluid dispensing as well as flexible high-mix SMT placement solutions. Both divisions leverage the company’s vast equipment and process know-how gained since 1991 to let their customers achieve significant competitive advantages. The company’s goal is to improve its customers’ workflows, setup times, defect rates, traceability and overall manufacturing efficiency through superior software and by providing managed SMT storage.
Share on:
Suggested Items
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.
SolderKing Achieves the Prestigious King’s Award for Enterprise in International Trade
05/06/2025 | SolderKingSolderKing Assembly Materials Ltd, a leading British manufacturer of high-performance soldering materials and consumables, has been honoured with a King’s Award for Enterprise, one of the UK’s most respected business honours.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
'Chill Out' with TopLine’s President Martin Hart to Discuss Cold Electronics at SPWG 2025
05/02/2025 | TopLineBraided Solder Columns can withstand the rigors of deep space cold and cryogenic environments, and represent a robust new solution to challenges facing next generation large packages in electronics assembly.
BEST Inc. Reports Record Demand for EZReball BGA Reballing Process
05/01/2025 | BEST Inc.BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.