-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Manncorp’s New SMT/BGA Rework System Under $15k Handles any SMD Repair
August 27, 2015 | ManncorpEstimated reading time: 2 minutes

Manncorp has taken surface mount board repair to new levels of performance and affordability with the introduction of the new RW1210 Rework System. An enhanced touchscreen user interface now contains selectable operating modes that fully automate removal, placement, and soldering sequences for increased operator efficiency. In addition, the RW1210 includes an enlarged board holder to handle extra-large PCBs up to 430 mm x 360 mm (17" x 14.25"). Best of all, the RW1210 is supplied complete for only $14,995 and, out of the box, includes everything needed to tackle today’s most challenging surface mount board repairs.
The RW1210 comes standard with a 1.3 million pixel, split-vision CCD camera and a 15” 1080p high-resolution display. Joystick-controlled zoom with 230x magnification and high-brightness LED lighting provide ultra-clear, superimposed views of component leads and PCB solder pads for easy alignment using ultra-fine X, Y, and Θ axis micrometers. In conjunction with its high-precision Z-axis drive mechanism and automatic height sensing, the RW1210 provides the ±0.01mm placement accuracy needed for 0.3 mm (0.012") lead pitch µBGAs and delicate QFPs.
Five hot air nozzles are included, selected by the customer from a full assortment available for components from 2 x 2 mm to 55 x 55 mm. The nozzles direct hot air from the 1200W upper heater to the component and adjustable air flow control prevents even the smallest chip components from shifting during reflow. The 1200W bottom heater, essential for BGA repair, is surrounded by a 2700W, rapid IR underheater that quickly and efficiently heats the entire bottom surface of the PCB to prevent board warpage, reduce cycle times, and limit temperature exposure.
The RW1210’s multi-level, password-protected software includes sample temperature profiles for both lead-free and eutectic solders. These can easily be modified to suit different rework applications and then stored in the program library for later use. Set temperature versus actual temperature profiles measured through the unit’s built-in thermocouple input can be recorded and exported to a flash drive connected to a USB port on the front of the machine.
Manncorp offers free, on-site installation and training on the RW1210, which is also backed by a full two-year parts warranty and unlimited factory support.
About Manncorp
For nearly five decades, Manncorp has supplied electronics manufacturers with the world’s best values in PCB assembly equipment, direct to the customer, at the industry’s most competitive prices, and with full service and support. Offices worldwide: East (Huntingdon Valley, PA), West (San Diego, CA), Mexico, Brazil, China. www.manncorp.com
Suggested Items
ViTrox Marks 25 Years of Innovation with Cutting-Edge Solutions at NEPCON China 2025 in Shanghai
04/18/2025 | ViTrox TechnologiesViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce its participation in NEPCON China 2025, taking place from April 22–24, 2025, at Booth #1E45, Shanghai World Expo Exhibition & Convention Centre (SWEECC).
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
04/16/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Real Time with... IPC APEX EXPO 2025: Transition Automation Focusing on Security Coatings and Squeegee Technology
04/16/2025 | Real Time with...IPC APEX EXPOMark Curtin, President of Transition Automation, gives an update on recent innovations at his company. He highlights a record sales month and their new focus on security coatings to fight counterfeiting. Mark explains the engineering behind their durable squeegees, the importance of maintenance, and the value of considering overall costs over just price.
Indium to Feature Materials Solutions Powering Sustainability at PCIM Europe
04/15/2025 | Indium CorporationIndium Corporation specializes in power device packaging, offering a portfolio of advanced material solutions encompassing the entire assembly, including die-attach, top-side die interconnect, substrate-attach, package-attach, and PCB assembly.