Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Alpha to Present LED Technical Paper at IPC India Technical Conference 2015
August 27, 2015 | AlphaEstimated reading time: 2 minutes
Alpha, the world leader in the production of electronic soldering and bonding materials, will present a LED technical paper at IPC India Technical Conference 2015 from September 10 – 11, 2015 Pragathi Maidan, New Delhi, India.
The paper, co-authored with Multek, a global supplier of rigid and flexible printed circuits, explores how enabling the use of PET flexible circuits can provide significant system cost benefits compared to either FR4 rigid boards or Polyimide flexible circuits. In this study, Alpha utilizes its new generation low-temperature solder paste, Lumet™ P53 with SBX02 alloy to provide low-temperature LED package on PET substrate reflow capability, which enables the use of PET flex substrates.
Richard Puthota, Director of Business Development and Technical Support for Alpha – India, will be presenting the paper titled “Enabling the Use of PET Flexible Substrates for LED Lighting Applications” at the IPC India in New Delhi.
IPC India Technical Conference 2015
Date: September 10-11, 2015
Venue: Pragathi Maidan, New Delhi, India
Topic: Enabling the Use of PET Flexible Substrates for LED Lighting Applications
Speaker: Richard Puthota – Director of Business Development & Technical Support
Speaker Biography
Richard Puthota is a Director of Business Development & Technical Support at Alpha, where he is responsible for Alpha’s Business & Technical Support in India, Africa, Sri Lanka & Middle-East. Recently, he received the “President Award for the year of 2014” for creating an entire business model for sales, distribution channels & branding which led to share gain and continued growth in South Africa, a new market for the business.
Richard has over 30 years experiences in PCB assembly industry. He holds a BS Chemical Technology from Loyola College. Richard currently serves as Member of Corporate Advisory Board of SRM University, Industrial Advisory Committee of Loyola College and also Advisory Panel of India’s Electronics Magazines.
About Multek
Multek, a wholly owned subsidiary of Flextronics, is a leading value-add manufacturer of printed circuit board technologies offering a broad spectrum of PCB engineering and manufacturing expertise including high density interconnect, multilayer, flexible circuit and assembly solutions. Built upon a foundation of rapid response, technology leadership and high reliability solutions for PCB fabrication electronics design and manufacturing, Multek enables customers to take products to market quickly through early engineering, advanced technology new product introduction and volume production through a full range of high-performance products, materials and solutions.
About Alpha
Alpha, a business unit of Alent plc, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Americas, Europe and Asia Pacific regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™, Maxrel™, and Fortibond™ brands.
For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, liquid fluxes, solder pastes, cored wire, conductive adhesives and preforms for use in used in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.