Alpha to Present LED Technical Paper at IPC India Technical Conference 2015

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Alpha, the world leader in the production of electronic soldering and bonding materials, will present a LED technical paper at  IPC India Technical Conference 2015 from September 10 – 11, 2015 Pragathi Maidan, New Delhi, India.

The paper, co-authored with Multek, a global supplier of rigid and flexible printed circuits, explores how enabling the use of PET flexible circuits can provide significant system cost benefits compared to either FR4 rigid boards or Polyimide flexible circuits.  In this study, Alpha utilizes its new generation low-temperature solder paste, Lumet™ P53 with SBX02 alloy to provide low-temperature LED package on PET substrate reflow capability, which enables the use of PET flex substrates. 

Richard Puthota, Director of Business Development and Technical Support for Alpha – India, will be presenting the paper titled “Enabling the Use of PET Flexible Substrates for LED Lighting Applications” at the IPC India in New Delhi. 

IPC India Technical Conference 2015

Date: September 10-11, 2015

Venue: Pragathi Maidan, New Delhi, India

Topic: Enabling the Use of PET Flexible Substrates for LED Lighting Applications

Speaker: Richard Puthota – Director of Business Development & Technical Support

Speaker Biography         

Richard Puthota is a Director of Business Development & Technical Support at Alpha, where he is responsible for Alpha’s Business & Technical Support in India, Africa, Sri Lanka & Middle-East. Recently, he received the “President Award for the year of 2014” for creating an entire business model for sales, distribution channels & branding which led to share gain and continued growth in South Africa, a new market for the business.

Richard has over 30 years experiences in PCB assembly industry. He holds a BS Chemical Technology from Loyola College.  Richard currently serves as Member of Corporate Advisory Board of SRM University, Industrial Advisory Committee of Loyola College and also Advisory Panel of India’s Electronics Magazines.

About Multek

Multek, a wholly owned subsidiary of Flextronics, is a leading value-add manufacturer of printed circuit board technologies offering a broad spectrum of PCB engineering and manufacturing expertise including high density interconnect, multilayer, flexible circuit and assembly solutions. Built upon a foundation of rapid response, technology leadership and high reliability solutions for PCB fabrication electronics design and manufacturing, Multek enables customers to take products to market quickly through early engineering, advanced technology new product introduction and volume production through a full range of high-performance products, materials and solutions.

About Alpha

Alpha, a business unit of Alent plc, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Americas, Europe and Asia Pacific regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax®, Atrox™, Maxrel™, and Fortibond™ brands.

For the LED segment, Alpha offers its Lumet™ products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, liquid fluxes, solder pastes,  cored wire, conductive adhesives and preforms for use in used in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.