The Chemical Connection: Through-glass Vias in Glass Substrates
It’s Only Common Sense: Why Sales Teams Fail (and How to Fix Them)
The Marketing Minute: A Brand Visibility Playbook—Get Seen, Heard, and Remembered
Henkel Forms Partnership with LPMS USA
September 22, 2015 | HenkelEstimated reading time: 2 minutes
In a move designed to offer customers greater access to low pressure molding solutions and its award-winning TECHNOMELT materials, Henkel Adhesive Technologies has formed a partnership with leading molding equipment manufacturer, LPMS USA.
“Henkel’s new relationship with LPMS USA is a very important development for our Americas-based customers,” explains Art Ackerman, Henkel Global Product Manager for Circuit Board Protection. “The company’s global leadership, in-depth understanding of mold design, broad equipment portfolio and low pressure molding expertise make LPMS USA a very competent partner.”
The low pressure molding process is a fast and effective alternative to traditional potting techniques. Leveraging the advanced capabilities of Henkel’s TECHNOMELT polyamide hotmelt products, LPMS USA systems process the materials in a simple operation that melts, molds and cools the TECHNOMELT materials around electronic devices to encapsulate them and form self-enclosed, functional assemblies. Because the low pressure molding process is lower stress compared to traditional injection molding, it is ideal for today’s finer-pitched, delicate devices and has been successfully employed in multiple applications including automotive, LED lighting, medical, wearables and household consumer products, among others.
LPMS USA offers a comprehensive portfolio of molding systems – ranging from handheld, tabletop units through to advanced, in-line automated platforms. The company’s expertise in mold design and thorough understanding of end-use requirements are key enablers for outstanding results. In addition, LPMS USA’s unique ‘melt on demand’ technology optimizes material use and energy consumption. Instead of keeping material molten for an entire shift, LPMS USA’s ‘melt on demand’ feature reduces heat residence of the TECHNOMELT material and only melts it when required. This is extremely beneficial for some of the newer white and optically clear TECHNOMELT formulations, and also reduces system cleaning time and downtime.
“Henkel is the premier materials supplier for low pressure molding materials,” says Kevin
Ross, VP of Sales and Marketing for LPMS USA. “The TECHNOMELT portfolio has won numerous awards and continues to expand to address emerging market requirements and new applications for low pressure molding processes. We are delighted to partner with Henkel and make the TECHNOMELT-LPMS USA solution available to customers across the Americas.”
For more information, visit www.henkel.com/electronics. Visitors to the upcoming SMTA International event, taking place over September 29 and 30 in Rosemont, IL, are invited to see TECHNOMELT and LPMS USA’s LPMS 500 in action during live demonstrations in Henkel booth #701.
About Henkel
Henkel operates worldwide with leading brands and technologies in three business areas:
Laundry & Home Care, Beauty Care and Adhesive Technologies. Founded in 1876, Henkel holds globally leading market positions both in the consumer and industrial businesses with well-known brands such as Persil, Schwarzkopf and Loctite. Henkel employs about 50,000 people and reported sales of $21.8 billion and adjusted operating profit of $3.4 billion in fiscal 2014. Henkel’s preferred shares are listed in the German stock index DAX.
Share on:
Suggested Items
Gorilla Circuits Elevates PCB Precision with Schmoll’s Optiflex II Alignment System
06/23/2025 | Schmoll MaschinenGorilla Circuits, a leading PCB manufacturer based in Silicon Valley, has enhanced its production capabilities with the addition of Schmoll Maschinen’s Optiflex II Post-Etch Punch system—bringing a new level of precision to multilayer board fabrication.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
American Made Advocacy: Supporting the Entire PCB Ecosystem—Materials to OEMs
06/17/2025 | Shane Whiteside -- Column: American Made AdvocacyWith the addition of RTX to PCBAA’s membership roster, we now represent the interests of companies in the entire PCB ecosystem. From material providers to OEMs, the insights of our collective members help us educate, advocate, and support legislation and policy favorable to America’s microelectronics manufacturers. The industry veterans who lead these companies provide valuable perspective, and their accumulated wisdom makes us an even stronger association.
Ventec Strengthens Commitment to Halogen-Free PCB Manufacturing in Europe
06/11/2025 | Ventec International GroupVentec International Group, the PCB materials innovator, manufacturer, supplier and one-stop shop for copper clad laminates, prepregs, as well as process consumables and PCB manufacturing equipment has established volume inventory of halogen-free FR4.1 and FR15.1 PCB materials at its European hub in Germany.
ACCM Joins Polar’s Speedstack Material Partner Program
06/10/2025 | Polar InstrumentsAdvance Chip & Circuit Materials has recently joined the Polar Speedstack Material Partner Program to ease the inclusion of ACCM's innovative Celeritas build up materials into the PCB supply chain.