The Knowledge Base: The Impact of Harsh Environments on Residue Tolerance
Standard of Excellence: Hiring for Quality Positions in Manufacturing, Engineering, and Management
Global Citizenship: What I’ve Learned About the American PCB Business
JTAG Technologies Inside: The Future of Your ATE Application with Boundary-scan
October 23, 2015 | JTAG TechnologiesEstimated reading time: 1 minute
The access to nodes of assemblies with ever increasing complexity is more and more difficult and results in reduced fault coverage. Test engineers worry about this daily.
JTAG Technologies’ motto for this productronica year reads: Optimise your ATE with JTAG Technologies Inside — have a look at the possibilities that arise from the use of “JTAG TECHNOLOGIES INSIDE” and see your current test methods and possibilities from a different perspective. In our booth A1.458 at productronica we will display the following highlights from our comprehensive ATE product portfolio:
- ICT, MDA or flying probe systems are quickly and easily upgraded with JTAG Technologies’ boundary-scan solutions. Special add-on cards and software integration suites enable users to benefit from the features of the combined systems.
- Traditional functional tests based on National Instruments’ LabView/TestStand, C++, .net and other programming languages often feature complex and time-consuming test programs. Easy access to your assembly via boundary-scan pins can simplify your existing test programs and ease diagnosis in case of faults.
Peter van den Eijnden, managing director of JTAG Technologies commented this year’s focus for the show: “Since many years we are cooperating with renowned ATE suppliers to make sure that our customers will continue to enjoy optimal use of their existing ICT/MDA/FPT/FCT systems throughout the coming years. In joint efforts with various test system manufacturers we developed special hardware and software solutions. These special solutions enable perfect integration of our tools into these test systems, so users benefit from advantages of the combination of both methods”.
About JTAG Technologies
JTAG Technologies is a market leader and technology innovator of boundary-scan software and hardware products and services. The company was the first to bring to the market such important advances as automated test generation, automated fault coverage analysis, automated flash and PLD programming via boundary-scan, and visualized boundary-scan analysis. Its customers include world leaders in electronics design and manufacturing such as Ericsson, Flextronics, Honeywell, Medtronic, Motorola, Nokia, Philips, Raytheon, Rockwell-Collins, Samsung, and Sony. Its innovative boundary-scan products provide test preparation, test execution, test result analysis and in-system programming applications. With an installed base of over 8500 systems worldwide, JTAG Technologies serves the communications, medical electronics, avionics, defence, automotive, and consumer industries with offices throughout North America, Europe and Asia. JTAG Technologies headquarters are located in Eindhoven, The Netherlands.
Share on:
Suggested Items
Skunk Works Demonstrates Airborne Battle Management of AI-Controlled Aircraft
11/27/2024 | Lockheed MartinLockheed Martin Skunk Works, in partnership with Lockheed Martin's Demonstrations and Prototypes organization and the University of Iowa's Operator Performance Laboratory (OPL), showcased a crewed-uncrewed teaming mission where an airborne battle manager issued real-time commands to AI-controlled aircraft through a touchscreen pilot vehicle interface (PVI).
NEOTech Significantly Improves Wire Bond Pull Test Process
11/25/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, proudly announces a major advancement in its wire bond pull testing process, reducing manufacturing cycle time by more than 60% while maintaining industry-leading production yields of over 99.99%.
Real Time with... electronica 2024: SPEA's AI Integration—Innovations in Test Equipment
11/25/2024 | Real Time with... electronicaIn this interview from electronica 2024, Pete Starkey speaks with Andrea Furnari, VP of Electronic Test Products Business Unit for SPEA. The discussion revolves around AI integration in test equipment, trends in substrate materials, and SPEA's focus on R&D.
Winners of IPC Hand Soldering World Championship at electronica 2024 Announced
11/21/2024 | IPCIPC hosted its Hand Soldering World Championship in Munich, Germany, at electronica on 14-15 November 2024, welcoming 14 competitors from 13 companies and 12 countries worldwide. Skilled contestants competed to build an electronics assembly in accordance with IPC-A-610 Class 3 criteria, and were judged on the functionality of the assembly, compliance with the assembly process and overall product quality. The contestants were allowed a maximum of 60 minutes to complete the assembly.
Indie Semiconductor Extends Automotive Photonics Leadership with Advanced Optical Component Integration Capabilities
11/20/2024 | indie Semiconductorindie Semiconductor, an automotive solutions innovator, has extended its photonics offering with the addition of in-house photonics integration, packaging and system test capabilities.