Compact Camera Module Market: The Access to Technology is Key
November 3, 2015 | Yole DéveloppementEstimated reading time: 2 minutes
“Critical technology shifts including 3D, computational, motion, infrared (IR) are ahead of us, with the camera module ultimately becoming the hub for multi-sensing,” says Pierre Cambou, Activity Leader at Yole Développement (Yole).Yole reveals its vision of the Compact Camera Module (CCM) industry in its first technology and market analysis dedicated to the CCM world. This report is entitled Camera Module Industry report and is based on both “bottom-up” and “top-down” methodologies.
With the camera module industry report, The “More than Moore” market research and strategy consulting company confirms its strategic positioning and discloses a new step towards a better understanding of this imaging industry and its technical evolution.
The camera module industry report from Yole, provides market data on key CCM metrics and dynamics (revenue forecast, volume shipments and sub-component breakdown by application), detailed market shares, a strong application focus on the key CIS growth areas (mobile, automotive, medical, security, machine vision …).
This analysis also proposes an overview of key technical insight, the future technology trends and challenges.
Access to technology is key in the CCM industry. At the image sensor level, access to Sony’s state-of-the-art 3D stacked sensors is a prerequisite for high-end, high-resolution modules. The integration of Phase Detection Auto Focus (PDAF) is another key technology feature. Most CMOS Image Sensors (CIS) vendors are quickly closing the technology gap with Sony, but as the investments get larger and larger only the biggest companies will be able to compete.
One key on-going technology shift for high-end CCM is the integration of Optical Image Stabilization (OIS) functionality. This critical feature is mainly provided by Korean and Japanese Voice Coil Motors (VCM) manufacturers. The high demand for VCM technology means stronger negotiating power for players with access to it. Other propositions using wafer-level techniques are being scrutinized. The Camera Module Industry report discusses the pros and cons of alternative Auto Focus (AF) & OIS technologies.
Under this new CCM analysis, Yole proposes a technical analysis of each application including current and future technology trends. In the automotive sector for example, forward facing cameras are increasing in complexity. Yole’s experts detail several examples:
• Volvo equips all of its cars with the City Safety triple camera system. It has announced that its future system will implement a stereo and central camera.
• Subaru Eyesight (from Fuji Heavy Industry) is a stereo camera system that equips most vehicles of the brand sold in Japan.
CCM’s future will also include new sensor types that serve not only sensing but also video and photography. “Many developments are currently underway, especially for 3D” explains Pierre Cambou from Yole. “The smartphone revolution is not yet 10 years old and the action sports camera revolution is not even three years old,” he adds. The imaging industry is digesting waves of innovation at a pace unseen anywhere else. The sensing revolution, including computational imaging techniques, will probably be next to occur.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Technica USA Advocates for PCBAA Membership Among Printed Circuit Assembly Customers
09/16/2025 | Technica USATechnica USA is actively encouraging its printed circuit assembly customers to join the Printed Circuit Board Association of America (PCBAA), a leading industry organization advocating for increased domestic production of printed circuit boards (PCBs) and substrates.
Marcy’s Musings: Advancing the Advanced Materials Discussion
09/17/2025 | Marcy LaRont -- Column: Marcy's MusingsAs the industry’s most trusted global source of original content about the electronics supply chain, we continually ask you about your concerns, what you care about, and what you most want to learn about. Your responses are insightful and valuable. Thank you for caring enough to provide useful feedback and engage in dialogue.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
ICAPE Group Unveils Exclusive Report on Sustainability in Electronics Manufacturing
09/15/2025 | ICAPE GroupICAPE Group, a global leader in printed circuit boards (PCBs) and custom electronics manufacturing, today announces the launch of its 2025 Industry Outlook & Innovation Report: Sustainability in Electronics Manufacturing. This exclusive report is accompanied by fresh insights from a dedicated Statista survey of 100 electronics manufacturing professionals, commissioned by ICAPE Group.
Panasonic Industry will Double the Production Capacity of MEGTRON Multi-layer Circuit Board Materials Over the Next Five Years
09/15/2025 | Panasonic Industry Co., Ltd.Panasonic Industry Co., Ltd., a Panasonic Group company, announced plans for a major expansion of its global production capacity for MEGTRON multi-layer circuit board materials today. The company plans to double its production over the next five years to meet growing demand in the AI server and ICT infrastructure markets.