Nolan’s Notes: Finding Your Sweet Spot
Standard of Excellence: Delivering Excellence—A Daily Goal
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
Mirtec Receives 2015 Global Technology Award for MV-6 OMNI 3D AOI System
November 11, 2015 | MirtecEstimated reading time: 1 minute
MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2015 Global Technology Award in the category of Best Product – Asia for its MV-6 OMNI 3D In-Line AOI Series. The award was presented to the company during a Tuesday, Nov. 10, 2015 ceremony that took place at the Messe München exhibition center in Munich, Germany during Productronica.
“The 2015 Global Technology Award represents the 27th industry award that has been presented to MIRTEC in recognition of our Technologically Advanced Inspection Solutions,” stated Brian D’Amico, president of MIRTEC’s North American Sales and Service Division. “It is truly our pleasure to accept this award on behalf of MIRTEC’s extremely talented engineering team for their outstanding performance in the design and development of the MV-6 OMNI 3D AOI machine. We are confident that this advanced technology will not only provide unprecedented speed and performance to the electronics inspection industry, but will undoubtedly set a new standard by which all other inspection equipment will be measured.”
The ALL NEW MV-6 OMNI 3D In-Line AOI Machine is configured with MIRTEC’s exclusive OMNI-VISION® 3D inspection technology which combines the award-winning 15 Mega Pixel CoaXPress Vision System with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system in a newly designed cost-effective platform.
MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with the company’s complete product range of 3D inspection systems. MIRTEC’s Digital Multi-Frequency Quad Moiré Technology provides true 3D inspection using a total of four (4) Programmable Digital Moiré Projectors. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow.
Fully configured, the new MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera. There is little doubt that this new technology will set the standard by which all other inspection equipment will be measured.
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
About MIRTEC
MIRTEC is a leading global supplier of automated inspection systems to the Electronics Manufacturing Industry. For further information, please visit www.mirtec.com.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.