-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Mirtec Receives 2015 Global Technology Award for MV-6 OMNI 3D AOI System
November 11, 2015 | MirtecEstimated reading time: 1 minute
MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2015 Global Technology Award in the category of Best Product – Asia for its MV-6 OMNI 3D In-Line AOI Series. The award was presented to the company during a Tuesday, Nov. 10, 2015 ceremony that took place at the Messe München exhibition center in Munich, Germany during Productronica.
“The 2015 Global Technology Award represents the 27th industry award that has been presented to MIRTEC in recognition of our Technologically Advanced Inspection Solutions,” stated Brian D’Amico, president of MIRTEC’s North American Sales and Service Division. “It is truly our pleasure to accept this award on behalf of MIRTEC’s extremely talented engineering team for their outstanding performance in the design and development of the MV-6 OMNI 3D AOI machine. We are confident that this advanced technology will not only provide unprecedented speed and performance to the electronics inspection industry, but will undoubtedly set a new standard by which all other inspection equipment will be measured.”
The ALL NEW MV-6 OMNI 3D In-Line AOI Machine is configured with MIRTEC’s exclusive OMNI-VISION® 3D inspection technology which combines the award-winning 15 Mega Pixel CoaXPress Vision System with MIRTEC’s revolutionary Digital Multi-Frequency Quad Moiré 3D system in a newly designed cost-effective platform.
MIRTEC’s 15 Mega Pixel CoaXPress Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with the company’s complete product range of 3D inspection systems. MIRTEC’s Digital Multi-Frequency Quad Moiré Technology provides true 3D inspection using a total of four (4) Programmable Digital Moiré Projectors. This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow.
Fully configured, the new MIRTEC MV-6 OMNI machines feature four (4) 10 Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera. There is little doubt that this new technology will set the standard by which all other inspection equipment will be measured.
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
About MIRTEC
MIRTEC is a leading global supplier of automated inspection systems to the Electronics Manufacturing Industry. For further information, please visit www.mirtec.com.
Suggested Items
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Indium Corporation Expert to Present on Pb-Free Solder for Die-Attach in Discrete Power Applications
04/30/2024 | Indium CorporationIndium Corporation Product Manager – Semiconductor Dean Payne will present at the Advanced Packaging for Power Electronics conference, hosted by IMAPS, held May 8-9 in Woburn, Massachusetts, USA.
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.