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Dan’s Biz Bookshelf: ‘The Wizard and the Warrior: Leading with Passion and Power’

10/16/2024 | Dan Beaulieu -- Column: Dan's Biz Bookshelf
The fact that this book talks about different styles of leadership and helps you define and identify the types of leaders is what makes it interesting. Here are two names you’ve likely never heard in the same sentence: Richard Nixon and Mother Teresa. They both did a lot of good—arguably Mother Teresa more than Nixon and perhaps on a smaller stage—but they each had a dark side. I think we all know about Nixon’s dark side. Although a brilliant strategist, he was practically devoured by demons of small-mindedness—paranoia that led to his demise.

Dana on Data: Resurrecting IPC Class 1

10/01/2024 | Dana Korf -- Column: Dana on Data
IPC specifications and guidelines have been the standard performance, quality, acceptance, and design basis for PCB designs for approximately two generations. They have proven to be conservative enough that PCBs far exceed their expected lifetimes in a multitude of environments. Requirements are continually adjusted to reflect improvements in materials and process capability that match the increasing component, interconnect, and cost reduction demands.

Trouble in Your Tank: Interconnect Defect—The Three Degrees of Separation

10/01/2024 | Michael Carano -- Column: Trouble in Your Tank
It has been well documented that, with a very expensive and complex printed circuit board, thermal and mechanical excursions often find weaknesses. A lack of robustness and poor process control often leads to the exploitation of those weaknesses. An interconnect defect (ICD) often goes undetected until the printed circuit board reaches the final assembly stage or undergoes multiple thermal cycles, including interconnect stress tests or thermal shock. It is impossible to rework the ICD defect. But unlike voids, if detected in time, the panels can be reprocessed.

The Pulse: Commonsense Cost Cutting

08/29/2024 | Martyn Gaudion -- Column: The Pulse
One difference between engineering and pure science is that engineers (in most situations) are looking for cost-effectiveness. They do so by designing the most appropriate level of technology to maximize profitability with acceptable levels of application functionality. One area that is often overlooked is the energy cost of PCB production. At a recent EIPC conference, Dr. Maarten Cauwe of IMEC in Belgium presented a combined study of the lifecycle impact (LCI) of electronics systems and subassemblies. The study looked at the supply chain as well as the energy impact of HDIs.

AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Ohio Valley Expo & Tech Forum

08/13/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Michigan Expo & Tech Forum taking place on August 29 at the Embassy Suites by Hilton Cleveland-Rockside in Independence, Ohio.
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