The Knowledge Base: The Impact of Harsh Environments on Residue Tolerance
Standard of Excellence: Hiring for Quality Positions in Manufacturing, Engineering, and Management
Global Citizenship: What I’ve Learned About the American PCB Business
Standards Committee Updates at IPC
November 20, 2015 | IPCEstimated reading time: 5 minutes
The 7-11 Test Methods Subcommittee to review a proposal by Gerard O’Brien, StandS Group, for using XRF to determine phosphorous content in ENIG. There was a discussion of a Validation Process and Method Review for IPC methods. They proposed that the TAEC review all released Test Methods, new and revised. Also proposed that IPC could potentially provide validation for Test Method operators and auditing to ensure proper testing.
The 7-12 Microsection Subcommittee met to continue the revision of IPC-9241, Microsectioning Guideline (formerly MS-810) and review the comments on KAVI. Feedback from the recently released TM 2.1.1F, Microsectioning, Manual Method and a proposed Microsectioning Training course were also discussed.
The D-32 Thermal Stress Test Methods Subcommittee met to discuss the next steps moving forward on the revision of TM 2.6.7.2, Thermal Shock and 2.6.27, Thermal Stress. A PIN is to be drafted and discussed at the next teleconference.
Process Control
The 7-23 Assembly Process Effects Handbook Subcommittee met to discuss the format and content of the new IPC-9111, Troubleshooting for Printed Board Assembly Processes, before going to Final Industry Review.
Product Assurance
The 7-30 Product Assurance Committee reviewed the status of the projects in its scope and started planning for the meetings to be held in APEX 2016.
The 7-31b IPC-A-610 Task Group reviewed comments on IPC-A-610, Acceptability for Electronic Assemblies. The Task Group met a second day to resolve comments on criteria comment to both IPC-A-610, Acceptability for Electronic Assemblies, and IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. The group also celebrated completion of the forthcoming IPC-A-610 Revision F Amendment 1.
The 7-31bc Telecom Addendum Task Group met to continue discussions on the revision of the document. The Task Group plans to update the addendum using Revision F of IPC-A-610, Acceptability for Electronic Assemblies as the base document.
The 7-31f Task Group responsible for IPC-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies, met to continue revision work on the document.
The 7-31j Task Group met to continue revising IPC-A-630, Acceptability Standard for Manufacture, Inspection and Testing of Electronic Enclosures. The Task Group also discussed and approved a new title for the standard that will be introduced with the revision.
The 7-31k Wire Harness Design Task Group and 7-31h IPC-HDBK-620 Handbook Task Group met to celebrate the forthcoming IPC-D-620, Design and Critical Process Requirements for Cable and Wiring Harnesses, and to open discussion on IPC-HDBK-620, Handbook and Guide to Supplement IPC-A-620.
The 7-31m Fiber Optic Cable Acceptability Task Group agreed to split the working draft IPC-A-640 into separate standards for design (IPC-D-640) and acceptance (IPC-A-640). Because most of the content for the design document is already on hand, the group will focus first on IPC-D-640, with plans to ballot by APEX/EXPO, and will pick up work on IPC-A-640 near that time, with a goal to publish later in 2016.
The 7-32c Electrical Continuity Task Group met to review industry responses to a survey on adjacency testing for bare printed board electrical test. Additional input on the need to specify a minimum retention period for electrical test data and clarification on when electrical testing for Class 3 product can be agreed upon between user and supplier drove the group to determine that a “B” revision to the IPC-9252, Requirements for Electrical Testing of Unpopulated Printed Boards, should be developed for a 2016 release.
The 7-34 Repairability Subcommittee met to continue revising IPC-7711/21, Rework, Modification and Repair of Electronic Assemblies.
Share on:
Suggested Items
IPC Japan Puts More Focus on Collaboration, Standards Development, Advanced Packaging
11/26/2024 | Yusaku Kono, IPC Japan RepresentativeIn the past year, IPC has strengthened its relationships with key Japanese companies and government bodies. This was accomplished, in part, by a visit to Japan this past summer, where members of the IPC Asia team, punctuated by standards committee work last winter, forged stronger ties with government officials and companies involved in electronics manufacturing.
IPC Hall of Fame Spotlight Series: Highlighting Patty Goldman
11/22/2024 | Dan Feinberg, I-Connect007In my first article of this special series, I wrote a synopsis of the IPC Raymond E. Pritchard Hall of Fame (HOF) Award, along with a commentary on its first few members, particularly Pritchard. Over the years, IPC members who have contributed significantly to IPC and our industry have been awarded this high honor and recognition. Though many early HOF members have passed away and are unknown to today’s IPC membership, their contributions still resonate. Over the coming months, I look forward to researching and reporting on IPC Hall of Fame members and their contributions. This month, I highlight Patty Goldman.
Winners of IPC Hand Soldering World Championship at electronica 2024 Announced
11/21/2024 | IPCIPC hosted its Hand Soldering World Championship in Munich, Germany, at electronica on 14-15 November 2024, welcoming 14 competitors from 13 companies and 12 countries worldwide. Skilled contestants competed to build an electronics assembly in accordance with IPC-A-610 Class 3 criteria, and were judged on the functionality of the assembly, compliance with the assembly process and overall product quality. The contestants were allowed a maximum of 60 minutes to complete the assembly.
IPC Issues Clarion Call for EU to Reclaim Leadership in Electronics Manufacturing
11/21/2024 | IPCIPC released a synopsis of its recent white paper, Securing the European Union’s Electronics Ecosystem. This condensed document presents a comprehensive overview of the current challenges in Europe’s electronics manufacturing industry and shares actionable steps to help the EU achieve a stronger, more autonomous ecosystem.
Enjoy the Journey: PCB Design Instructor Kris Moyer on His Sustainable Lifestyle
11/19/2024 | Michelle Te, IPC CommunityWhen I contacted IPC design instructor Kris Moyer to discuss his sustainable lifestyle, he responded to my text with a call. "I'm calling you from about 8,000 feet, sitting at the foot of Mammoth Lakes," he told me. “My friends and I are about to get in the pool for the afternoon." Kris can do this because he actually lives full-time in his travel-trailer at this campground. He's now a permanent camper, taking him anywhere the winds blow—and where there's strong internet service—so he can teach his PCB design classes, offer expert interviews, and live off the land.