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Advanced Electronics Packaging Digest

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DYCONEX Establishes BIOCONEX to Extend its Medical Technology Portfolio

09/09/2026 | DYCONEX
DYCONEX AG announces the establishment of BIOCONEX AG, a wholly owned Swiss subsidiary dedicated to transforming substrate technologies manufactured by DYCONEX into customer-specific, ready-to-integrate sub-components for medical devices.

NanoBridge Adopts Siemens’ Precision FPGA Synthesis for Low-Power Innovation

09/04/2026 | Siemens
Siemens announced that NanoBridge Semiconductor, Inc. (NBS), a Japanese semiconductor company developing low-power and harsh-environment semiconductor technologies, has adopted Siemens’ Precision FPGA Synthesis for its field-programmable gate array (FPGA) development initiatives.

Teradyne Launches Advanced UltraFLEXplus Instruments Engineered for AI and Data Center Computing Devices

09/03/2026 | Teradyne
Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, announced the launch of three new instruments for its UltraFLEXplus platform, designed to meet the increasingly complex demands of AI and data center semiconductor testing.

GigaDevice Expands EMEA and Southeast Asia Reach with Rutronik Partnership

08/31/2026 | BUSINESS WIRE
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, announced a new strategic franchise partnership with Rutronik Elektronische Bauelemente GmbH, one of Europe’s leading broadline distributors of electronic components.

Omdia: Southeast Asia Smartphone Shipments Fall 23% to 12-Year Low

08/27/2026 | BUSINESS WIRE
Southeast Asia’s smartphone market declined 23% year-on-year in 2Q26, with shipments falling to 19.3 million units, the lowest quarterly level since 2014, according to the latest research from Omdia.
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