-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
i3 Electronics’ Frank Egitto Wins Lifetime Achievement Award
November 25, 2015 | i3 ElectronicsEstimated reading time: 5 minutes
Frank D. Egitto, Director of Research and Development at i3 Electronics, Inc. in Endicott, NY was presented with the Technology Innovation Lifetime Achievement Award by the Small Scale Systems Integration and Packaging Center (S³IP), Binghamton University, and the Empire State Development Division of Science, Technology & Innovation (NYSTAR) at the S³IP Annual Dinner & Business Meeting on November 4, 2015.
In introducing the presenter of the award, Steve Czarnecki, Associate Director of S³IP stated, “Our final category is, in some ways, the most significant, and to me, the most prestigious: life is not a sprint, but a marathon. It is, after all so often the case that it’s sustained performance that matters. To that end, we have the Technology Innovation Lifetime Achievement award. This award, given only infrequently, recognizes an individual in the electronics packaging industry who has built a lifetime record of leadership and service to the industry as well as the University.” The award was presented by Dr. Mark Poliks, Director of the Center for Advanced Microelectronics Manufacturing (CAMM), and longtime friend and colleague of Mr. Egitto.
An alumnus of Binghamton University, where he earned BA and MA degrees in Physics, Mr. Egitto has maintained a long standing relationship with the university and its faculty. “Collaborative work with the S³IP Center has been a productive and mutually beneficial partnership”, stated Mr. Egitto. “Because of the nature of my work, this has been especially true with respect to the Integrated Electronics Engineering Center (IEEC), the Analytical and Diagnostics Laboratory (ADL), and the CAMM, the nation’s first prototype research and development facility in large area flexible electronics.
In his nearly thirty-eight years working in the microelectronics industry, thirty-three of which has been in Endicott, Mr. Egitto’s activities have focused on research and development on materials, equipment, design, and processes for fabrication of integrated circuit chips and advanced microelectronic packaging solutions. Previous work experience includes employment with Texas Instruments, Dallas, TX, Applied Materials Plasma Etch Division, Santa Clara, CA, IBM Microelectronics Division, Endicott, NY, Endicott Interconnect Technologies, Inc., Endicott NY and i3 Electronics Inc., Endicott NY. His areas of expertise include plasma interactions with materials, laser ablation, modification of polymers with ultraviolet radiation, and advanced packaging. He is the author or coauthor of eight book chapters and over eighty technical papers, and holds eighty-seven US patents. He has served on the Technical Advisory Board and the Industrial Advisory Board for the IEEC at Binghamton University. He has had a career of leadership in moving projects through research and development into manufacturing of equipment, high-density flexible circuitry, semiconductor packaging, and printed wiring boards.
“My career has afforded me the opportunity to bring fundamental scientific and engineering principles to bear on real world applications, and taking these applications from feasibility demonstration to real products that enhance the lives of others. By far, the most fulfilling aspect of my work has been my collaboration with colleagues in industry and academia, who I consider to be among the best and brightest, truly world-class in their respective areas of expertise. In addition, throughout my career, I’ve been fortunate that management has fostered innovation by supporting the freedom to work on emergent technologies using a fundamental scientific approach to development and problem solving. Of course, the opportunities for innovation are never-ending and expanding, with microelectronics continually moving into new and challenging areas of science and technology,” stated Mr. Egitto.
“Frank Egitto is a true asset to i3 Electronics. His dedication to this company and the impact he has made on the microelectronics industry cannot be overstated. Here at i3 Electronics, we are truly honored and proud to have Frank as part of our organization and look forward to his continued work. I would also like to personally congratulate Frank on this well-deserved award, stated Dale Kersten, Executive Vice President and Chief Business Officer at i3 Electronics.
Page 1 of 2
Suggested Items
Foxconn Makes Its CES Debut, Unveiling Diverse Automotive Electronics Solutions
01/02/2025 | FoxconnFIH, a subsidiary of Hon Hai Technology Group (Foxconn) will make its CES debut in Las Vegas from January 7 to 10, 2025, showcasing its wide-ranging automotive electronics solutions. In response to the growing complexity and diversity of in-vehicle applications,
IPC: PCB Designers Invited to Attend PEDC-Pan-European Electronics Design Conference
12/30/2024 | IPCThe Pan-European Electronics Design Conference (PEDC), co-hosted by FED and IPC, will take place on January 29-30, 2025.. This two-day conference, held in English, will bring together global PCB designers for a comprehensive exchange of ideas and insights on the latest trends and technologies in electronics design.
Delta Electronics Hosts the Largest, Most Electrifying New Year Party Yet
12/27/2024 | Delta ElectronicsDelta Electronics (Thailand) Public Company Limited, a global leader in power management and IoT-based smart green solutions history on December 20, 2024, with the remarkable New Year Party the company has ever hosted.
Delta Electronics, Cal-Comp Strengthen Partnership to Drive Innovation in Industrial Automation
12/25/2024 | Delta ElectronicsDelta Electronics (Thailand) Public Company Limited, a global leader in power management and IoT-based smart green solutions, and Cal-Comp Electronics (Thailand) Public Company Limited (SET Ticker: CCET), a leading industry 4.0+ electronics manufacturing services (EMS) provider, have signed a Memorandum of Understanding (MOU) to deepen their collaboration in industrial automation.
Market-Comms, VNU Asia Pacific Unite to Drive THECA 2025 as a PCB Industry Game-Changer
12/23/2024 | EINPresswire.comThailand Electronics Circuit Asia (THECA) 2025 has officially announced its event partnership with Market-Comms Co., Ltd. (MCOMMS), No.1 local public relations firm, and VNU Asia Pacific, the designated show manager for the event.