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Advanced Electronics Packaging Digest

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Suggested Items

From IPC Standards to Practical DFM

10/21/2026 | Marcy LaRont, I-Connect007
DFM seems like common sense: If we know the rules a PCB must meet, why not check the design against them before it ever reaches the factory? In practice, of course, it’s not quite that simple. I caught up with Susan Kayesar, product manager at Siemens and longtime contributor to Global Electronics Association standards activities, to talk about an ongoing effort between Siemens and the Association to translate IPC requirements into practical, software-based DFM checks. Susan explains where standards lend themselves to automation, where the gray areas begin, and why checking for IPC compliance is an important starting point, but not a substitute for understanding the capabilities and limitations of the fabricator who will actually build the board.

Stan Rak’s Road to Reliability Continues

10/07/2026 | Nolan Johnson, SMT007 Magazine
Dr. Stanton Rak spent the better part of this past year taking readers inside the electronic systems that enable electrification through his “Road to Reliability” series, to find out what it takes to make them reliable. Now that the series has concluded, he explains his motives for writing it, his holistic approach to covering EV reliability, and how it can become an important technology driver for high reliability electronics more broadly.

Closing the Gap: Measuring 20-µm Spacing in Advanced SiP Packaging

09/18/2026 | Axel Lindloff, Koh Young Europe
Twenty microns does not leave much room for error. As advanced packaging increases functional density, the distance between neighboring devices is shrinking to dimensions that create an entirely new set of inspection challenges. In some system-in-package (SiP) applications, components approximately 200 to 300 µm tall can be separated by gaps of only 20 to 30 µm. Measuring those spaces accurately requires considerably more than simply increasing camera magnification. The challenge is optical access.

Marcy’s Musings: A World of Difference

09/17/2026 | Marcy LaRont -- Column: Marcy's Musings
I've spent a good deal of time in Asia over the years, both traveling and living there, so arriving in Thailand for THECA wasn't my first experience stepping into another culture or another way of doing business. Still, there is something about being there—moving through a different city, sitting down with people, listening to their conversations, and watching how they approach familiar challenges—that gets me thinking.

A University Model for Training the Next Generation of PCB Designers

08/19/2026 | Marcy LaRont, I-Connect007
Veteran PCB designer and educator John Watson has building one of the nation's most comprehensive university-based PCB design certificate programs in the country. He’s working with Palomar College, UC San Diego, UC Santa Cruz, and UMass Lowell to teach the complete design-to-manufacturing process while connecting students with internships and career opportunities. I spoke with John about the industry's workforce challenges, building meaningful educational pathways, and why the next generation of PCB designers may come from places few would expect.
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